User manual

Kontron Compact Computers AG SMX945 Detailed Manual V1.1
85
11. INDEX
A
AC97 Audio Signals ................................................... 58
ACPI Suspend Modes................................................ 65
Analog Display ........................................................... 24
Assembly / Disassembly ............................................ 33
B
Battery Current........................................................... 21
BIOS..................................................................... 22, 67
BIOS ROM ................................................................. 22
Block Diagram............................................................ 14
BUS............................................................................ 16
C
Catastrophic Thermal Protection................................ 63
CMOS RAM Map ....................................................... 23
COMexpress Connector Description.......................... 36
COMexpress Connector Pinout.................................. 37
COMexpress Connector Specifications...................... 41
Component Heights ................................................... 32
Connector Placement........................................... 29, 30
Coprocessor......................................................... 15, 16
Core Duo.................................................................... 62
D
Design-In.................................................................... 26
Detailed Specifications............................................... 62
Dimensions ................................................................ 27
Dimensions of the Carrier Board Connector............... 32
Disclaimer .................................................................... 5
Dog ............................................................................ 16
E
EEPROM Memory for Setup ...................................... 22
EMI / EMC.................................................................. 17
Environmental Protection Statement............................ 5
F
Features, Standard .................................................... 12
Features, Unique........................................................ 13
G
Graphics Controller .................................................... 24
H
Heat Sink.................................................................... 33
Height of the Module Stack ........................................ 30
I
IDE Signals................................................................. 57
Integrated DVO .......................................................... 24
Integrated LVDS......................................................... 24
Intel 945GM Express.................................................. 24
ISO 9001:2000 ........................................................... 11
J
Jumpers...................................................................... 24
L
LAN Signals................................................................ 60
LED Criteria................................................................ 25
M
Manual, How to Use It .................................................. 2
Mechanical Assembly................................................. 26
Mechanical Dimensions.............................................. 31
Memory Address Map ................................................ 23
O
Ordering Codes .......................................................... 17
P
PCI Resources ........................................................... 66
Pin Definition .............................................................. 29
Power Input ................................................................ 20
Power Management ................................................... 16
Power Planes ............................................................. 61
Power Supply ............................................................. 16
Power Supply Sequencing ......................................... 20
R
Real Time Clock ......................................................... 21
Recycling Information................................................... 6
RoHS Commitment....................................................... 9
ROM-BIOS ................................................................. 22
RTC............................................................................ 21
RTC-Address Map...................................................... 21
S
Safety Precautions ....................................................... 9
Schematics................................................................. 67
SDVO / PEG Multiplexed Signals............................... 42
Signal Descriptions..................................................... 47
Signal Integrity Requirements .................................... 55
Signal Loss................................................................. 43
Signal Terminology Descriptions ................................ 36
SODIMM-DDR2 RAM................................................. 34
Specifications ............................................................. 15