User manual

Kontron Compact Computers AG SMX945 Detailed Manual V1.1
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6.2.1. Passive/Active Heat Sink....................................................................................................... 33
6.2.2. SODIMM-DDR2 RAM............................................................................................................ 34
6.3. COMexpress Connector Description ......................................................................................... 36
6.3.1. Signal Terminology Descriptions ........................................................................................... 36
6.3.2. COMexpress Connector Pinout............................................................................................. 37
6.3.3. COMexpress Connector Specifications................................................................................. 41
6.3.4. SDVO / PEG Multiplexed Signals.......................................................................................... 42
6.4. Signal Loss ................................................................................................................................... 43
6.5. Layout of High Speed Signals: ................................................................................................... 44
6.5.1. Design Rules for PCIexpress ................................................................................................ 44
6.5.2. Layout Rules.......................................................................................................................... 45
6.5.3. Eye Diagram with 6GHz/20GS Digital Scope........................................................................ 46
6.6. Signal Descriptions...................................................................................................................... 47
6.7. Signal Integrity Requirements .................................................................................................... 55
6.8. Thermal Specifications ................................................................................................................ 55
7. DESIGN RULES FOR THE INTEGRATION ........................................................................................................56
7.1. Video Signals................................................................................................................................ 56
7.2. IDE Signals.................................................................................................................................... 57
7.3. AC97 Audio Signals ..................................................................................................................... 58
7.4. USB2 Signal .................................................................................................................................. 59
7.5. LAN Signals .................................................................................................................................. 60
7.6. Power Planes ................................................................................................................................ 61
8. DETAILED SPECIFICATIONS.........................................................................................................................62
8.1. Intel Core Duo Processors .......................................................................................................... 62
8.2. Thermal Monitor and Catastrophic Thermal Protection........................................................... 63
8.2.1. Thermal Management ........................................................................................................... 63
8.2.2. The SMX945 ACPI Thermal Solution .................................................................................... 64
8.2.3. Implementation ...................................................................................................................... 64
8.3. ACPI Suspend Modes and Resume Events............................................................................... 65
8.4. PCI Resources .............................................................................................................................. 66
9. CORE BIOS...............................................................................................................................................67
10. SCHEMATICS .........................................................................................................................................67
11. INDEX....................................................................................................................................................85