User manual

DIGITAL-LOGIC AG MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7
93
10. THERMAL SPECIFICATIONS
The temperature is specified by 90°C for the BGA case. The table shows the allowable ambient temperature
at various airflows and with different heat sink configurations.
CPU: LX800 / T (case) = 90°C / Power consumption: 5W
Photo of heat sink
Heat sink type
Part Nr.
Product
MSM800…
CPU
Frequency
[MHz]
Air
Temperature
(ambient)
T case:
No Airflow
0m/sec
T case:
Airflow 3m/sec
T case:
Airflow 6m/sec
SEV
SEL
500 - - - -
BEV
500 85°C - - -
Thermo-
junction
807043
(see
Notes
below)
XEV
XEL
500 85°C - - -
SEV
SEL
500 - - - -
BEV 500 85°C 110°C 100°C 95°C
Large
807042
XEV
XEL
500 70°C 100°C 90°C 80°C
Small
807041
All
MSM800s
500 70°C 100°C 90°C 80°C
No
heat sink
All
MSM800s
500 60°C 90°C
Notes…
1. This thermojunction has been specifically designed by DLAG in almost 2 separate parts to
provide distinct heat dissipation for the CPU and the other onboard chips.
2. The holes in the thermojunction are for ø2mm screws. The holes in the casing/housing that will
be attached to the thermojunction should be ø2.5 or 3mm.