User manual

DIGITAL-LOGIC AG MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.5

9. THERMAL SPECIFICATIONS

9.1. Thermal Analysis for Case Integration

Since the integrated heat sink is uni-directional, the airflow must be exactly in the direction of the heat rails. If

possible, mount the board vertically, so that the heat rails are up/down. In this case, the self produced airflow

is about 3m/sec.

Pay particular attention when mounting the PC-product in a fully enclosed case/box. The thermal energy will

be stored in the interior of this environment.

If the case has a fan:

 The hot air must be exchanged with cool air from outside using a filtered fan.

 The hot air must be cooled with a heat exchanger.

If the case has no fan or opening to exchange the hot air:

 The heat sink of the CPU must be mounted directly to a heat sink integrated into the case. The

thermal energy does not go through the air; the heat will be conducted directly through the alloy of the

heat sink to the outside.