User`s manual

3.3 Hardware Configuration
a. Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used
to improve the thermal conductivity between the chip package and the
heat sink by replacing micro air pockets with a less insulative material.
Perform the following steps to position the GRAFOIL pad:
1) Perform a visual inspection of the package slug to ensure that it is
free of contamination.
2) Wearing clean gloves, pick up the GRAFOIL pad. Do not do this
with bare hands because skin oils can be transferred to the pad.
3) Place the GRAFOIL pad on the gold-plated slug surface and align
it with the threaded studs.
b. Attach the microprocessor heat sink. The heat sink material is clear
anodized, hot-water-sealed, 6061-T6 aluminum. The nut material is
2011-T3 aluminum (this grade is critical). Perform the following steps
to attach the heat sink:
1) Observe antistatic precautions.
2) Align the heat sink holes with the threaded studs on the ceramic
package.
3) Handle the heat sink by the edges and lower it on to the chip
package, taking care not to damage the stud threads.
4) Set a calibrated torque driver to 15 in-lb, 2 in-lb, (1.7 N m,
0.2 N m). The torque driver should have a mounted 3/8-in
socket.
5) Insert a nut into the 3/8-in socket, place on one of the studs, and
tighten to the specified torque. Repeat for second nut.
6) If the sink/chip/fan clip is used, install it properly by positioning
it over the assembly and hooking its ends around the ZIF socket
retainers.
Starting and Using the AlphaPC64 3–5