Datasheet

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Maßstab
Tag Name
F/UCW06
Reliability Test
Vervielfält.-Pause
Nr.
Arbeitspause Nr.
Tag Name
gezeichnet
bearbeitet
geprüft
normgepr.
2
Ersatz f.
Zeichn.
Zeichn.-Nr.
981211.6B
Untolerierte Maße Halbzeug, Werkstoff
Änd. Änd.-Mittlg.
zust. Nr.
18.01.99
18.01.99
Item Method of test Standard
Storage in
high temp.
Storage in +80°C test box for 240hours, then expose
to the room temperature for 2 hours without applying
power.
All specifications must be
satisfied in this condition.
Storage in
low temp.
Storage in –20°C test box for 240 hours, then expose
to the room temperature for 2 hours without applying
power.
All specifications must be
satisfied in this condition.
Life test in
room temp.
Operate continuously for 1000 hours with applying
rated voltage.
All specifications must be
satisfied in this condition.
Life test in
high temp.
Operate continuously in +70°C for 500 hours applying
7V.
All specifications must be
satisfied in this condition.
Life test in
low temp.
Operate continuously in –20°C for 500 hours applying
3V.
All specifications must be
satisfied in this condition.
Temperature
cycle test
Make this test for 5 cycles without applying power,
then expose to the room temperature for 2 hours.
All specifications must be
satisfied in this condition.
Humidity
cycle test
10h
1h
12h
1h
25°C 90-95% RH
65°C 90-95% RH
Make this test for 5 cycles without applying power,
then expose to the room temperature for 2 hours.
All specifications must be
satisfied in this condition.
Vibration test
10
55Hz
0.3g
9.3g
p-p=1.53
Make this test for the directions X,Y and Z for
30minutes each. To- and -fro sweep time is 1min.
All specifications must be
satisfied in this condition.
Drop test Drop a Buzzer naturally from the height of 800mm to
the surface of 10 mm thick wooden board.
Three directions (X,Y &Z)
All specifications must be
satisfied in this condition.
Solderability 230±5°C temperature of melted solder, 3 ± 0.5sec
duration of dipping. After test minimum 90% coverage
of surface
All specifications must be
satisfied in this condition.
Resistance
against
solder-heat
No deterioration after dipping in solder 260±5°C
for10sec.
All specifications must be
satisfied in this condition
Pin Strength Each Pin may withstand against pulling force of 1kg
for 30seconds
All specifications must be
satisfied in this condition