Datasheet

Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics
DS181 (v1.21) September 27, 2016 www.xilinx.com
Product Specification 2
I
DCIN-FLOAT
DC input current for receiver input pins DC coupled RX termination = floating
–
14 mA
I
DCIN-MGTAVTT
DC input current for receiver input pins DC coupled RX termination = V
MGTAVTT
–
12 mA
I
DCIN-GND
DC input current for receiver input pins DC coupled RX termination = GND
–
6.5 mA
I
DCOUT-FLOAT
DC output current for transmitter pins DC coupled RX termination = floating
–
14 mA
I
DCOUT-MGTAVTT
DC output current for transmitter pins DC coupled RX termination = V
MGTAVTT
–
12 mA
XADC
V
CCADC
XADC supply relative to GNDADC –0.5 2.0 V
V
REFP
XADC reference input relative to GNDADC –0.5 2.0 V
Temperature
T
STG
Storage temperature (ambient) –65 150 °C
T
SOL
Maximum soldering temperature for Pb/Sn component bodies
(6)
–+220°C
Maximum soldering temperature for Pb-free component bodies
(6)
–+260°C
T
j
Maximum junction temperature
(6)
–+125°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. The lower absolute voltage specification always applies.
3. For I/O operation, refer to 7 Series FPGAs SelectIO Resources User Guide (UG471
).
4. The maximum limit applies to DC signals. For maximum undershoot and overshoot AC specifications, see Table 4.
5. See Table 9 for TMDS_33 specifications.
6. For soldering guidelines and thermal considerations, see 7 Series FPGA Packaging and Pinout Specification (UG475).
Table 2: Recommended Operating Conditions
(1)(2)
Symbol Description Min Typ Max Units
FPGA Logic
V
CCINT
(3)
For -3, -2, -2LE (1.0V), -1, -1Q, -1M devices: internal supply voltage 0.95 1.00 1.05 V
For -1LI (0.95V) devices: internal supply voltage 0.92 0.95 0.98 V
For -2LE (0.9V) devices: internal supply voltage 0.87 0.90 0.93 V
V
CCAUX
Auxiliary supply voltage 1.71 1.80 1.89 V
V
CCBRAM
(3)
For -3, -2, -2LE (1.0V), -2LE (0.9V), -1, -1Q, -1M devices: block RAM supply
voltage
0.95 1.00 1.05 V
For -1LI (0.95V) devices: block RAM supply voltage 0.92 0.95 0.98 V
V
CCO
(4)(5)
Supply voltage for HR I/O banks 1.14 – 3.465 V
V
IN
(6)
I/O input voltage –0.20 – V
CCO
+0.20 V
I/O input voltage (when V
CCO
= 3.3V) for V
REF
and differential I/O standards
except TMDS_33
(7)
–0.20 – 2.625 V
I
IN
(8)
Maximum current through any pin in a powered or unpowered bank when
forward biasing the clamp diode.
–– 10mA
V
CCBATT
(9)
Battery voltage 1.0 – 1.89 V
GTP Transceiver
V
MGTAVCC
(10)
Analog supply voltage for the GTP transmitter and receiver circuits 0.97 1.0 1.03 V
V
MGTAVTT
(10)
Analog supply voltage for the GTP transmitter and receiver termination circuits 1.17 1.2 1.23 V
XADC
V
CCADC
XADC supply relative to GNDADC 1.71 1.80 1.89 V
Table 1: Absolute Maximum Ratings
(1)
(Cont’d)
Symbol Description Min Max Units