User Manual

18 MC13192 Product Preview MOTOROLA
Packaging Information
8 Packaging Information
Figure 8. Outline Dimensions for QFN-32, 5x5 mm
(Case 1311-03, Issue E)
N
EXPOSED DIE
ATTACH PAD
2.95
25
8
1
32
3.25
32X
0.18
0.30
24
17
16 9
0.5
M
0.1
C
M
0.05
C
A B
32X
0.5
0.3
C
0.1 A B
C
0.1 A B
VIEW M-M
0.25
28X
DETAIL M
PIN 1 INDEX
2.95
3.25
PIN 1
INDEX AREA
5
B
C
0.1
2X
2X
C
0.1
A
5
G
M
M
1.0
1.00
0.05
C0.1
C0.05
C
SEATING PLANE
5
DETAIL G
VIEW ROTATED 90° CLOCKWISE
(0.5)
(0.25)
0.8
0.75
0.00
(1.73)
(0.25)
0.065
32X
0.015
(45 )
5
4
PREFERRED CORNER CONFIGURATION
DETAIL N
0.60
0.24
0.60
0.24
4
DETAIL N
CORNER CONFIGURATION OPTION
DETAIL T
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
DETAIL T
BACKSIDE PIN 1 INDEX OPTION
(90 )
5
2X
2X
0.39
0.31
0.1
0.0
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
1.6
0.475
0.425
1.5
BACKSIDE
PIN 1 INDEX
0.25
0.15
R
DETAIL S
DETAIL M
PREFERRED BACKSIDE PIN 1 INDEX
0.217
0.137
(0.25)
0.217
0.137
(0.1)
DETAIL S
PREFERRED BACKSIDE PIN 1 INDEX
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. THE COMPLETE JEDEC DESIGNATOR FOR THIS
PACKAGE IS: HF-PQFP-N.
4. CORNER CHAMFER MAY NOT BE PRESENT.
DIMENSIONS OF OPTIONAL FEATURES ARE FOR
REFERENCE ONLY.
5. COPLANARITY APPLIES TO LEADS, CORNER
LEADS, AND DIE ATTACH PAD.
6. FOR ANVIL SINGULATED QFN PACKAGES,
MAXIMUM DRAFT ANGLE IS 12°.
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Freescale Semiconductor, Inc.
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