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ConnectCore 8X

System-on-module

Hardware Reference Manual -- Preliminary

Summary of content (114 pages)

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ConnectCore 8X System-on-module Hardware Reference Manual -- Preliminary
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Revision history—90002295 Revision Date Description 1P December Initial release 2018 2P January 2019 Added backdrive caution. 3P May 2019 Updated entire manual, including entire MCA section, some pin data, block diagram, and assembly information. 4P March 2020 Added North American certifications; added power consumption section; updated frequency value, variants nformation, and some graphics; updated MCA to trademarked name. 5P May 2020 Added operating temperature statement.
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Logs (from time of reported issue) Trace (if possible) Description of issue Steps to reproduce Contact Digi technical support: Digi offers multiple technical support plans and service packages. Contact us at +1 952.912.3444 or visit us at www.digi.com/support. Feedback To provide feedback on this document, email your comments to techcomm@digi.
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Contents About the ConnectCore® 8X Features and functionality Module variants Block diagrams ConnectCore 8X module NXP i.MX 8X application processor SOM revisions Identify the SOC revision of your SOM 6 8 9 9 10 10 10 The ConnectCore 8X System-on-module Power interfaces Reference power architecture scheme System-on-module power rails distribution Electrical characteristics System power-up sequence RTC power and coin cell charger Bootstrap Wireless interfaces WLAN IEEE 802.
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Module specifications Power consumption Power consumption use cases Complex power consumption use cases Results Environmental specifications 98 98 98 99 100 Assembly instructions Moisture sensitivity and shelf life Mounting Coplanarity Solder paste print Stencil SMT pick and place SMT process parameter reference Reflow profile 102 102 102 102 102 103 103 103 Regulatory information and certifications United States FCC Labeling requirements Maximum power and frequency specifications (FCC) FCC notices FCC-
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About the ConnectCore® 8X Features and functionality About the ConnectCore® 8X The ConnectCore 8X is a secure and extremely cost-effective connected System-on-Module platform. Its innovative Digi SMTplus™ (patent-pending) surface mount form factor allows you to choose simplified design integration leveraging proven and easy-to-use edge-castellated SMT technology, or a versatile LGA option for ultimate design flexibility with access to virtually all interfaces. Built on the NXP i.
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About the ConnectCore® 8X Features and functionality n Up to 4 GB, 32-bit LPDDR4-1200 memory. n 16 GB, 8-bit eMMC memory. Higher density available depending on product variant. n NXP PF8100 Power Management IC (PMIC): l 7x DC/DC buck converters. l 4x LDO regulators. l OTP (one-time-programmable) memory. l Coin cell charger. n CryptoAuthentication device. n Security accelerators: l l Enhanced High Assurance Boot (HAB) secure and encrypted boot.
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About the ConnectCore® 8X l n o 4x I2C: High Speed, DMA support. One of them (I2C0) is used internally in the SOM and is not available for general purposes. o 4x I2C: Low Speed, no DMA support. o 1x I2C: PMIC control (dedicated). o 1x I2C: Cortex M4F (dedicated). 4x SAI: o SAI0 and SAI1 are transmit/receive. o SAI2 and SAI3 are receive-only. l 2x Quad SPI or 1x Octal SPI (FlexSPI). l 1x SD 3.0 card interface. l Displays: l Module variants o 2x MIPI-DSI/LDVS.
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About the ConnectCore® 8X Block diagrams Block diagrams The following figures show block diagrams of the ConnectCore 8X module and of the NXP i.MX 8X application processor.
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About the ConnectCore® 8X SOM revisions NXP i.MX 8X application processor SOM revisions The ConnectCore 8X SOM uses an NXP i.MX8X system-on-chip (SOC). NXP released two revisions of the system-on-chip (SOC) silicon: n Revision B0 n Revision C0 On the C0 revision of the i.MX8X, NXP fixed most of the errata that were reported on B0. For a full list of fixes, see NXP Application Note AN12770.
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About the ConnectCore® 8X SOM revisions The red circle denotes Digi's revision of the ConnectCore 8X SOM. The following table correlates the ConnectCore 8X SOM revision with the i.MX8X SOC revision: SOM revision Description i.MX8X SOC revision 1P, 2P, ... Pre-production series B0 A, B, ... Mass production series C0 Note See the SOC revisions section of the ConnectCore 8X software documentation portal for more information.
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The ConnectCore 8X System-on-module Power interfaces The ConnectCore 8X System-on-module This section describes the functionality of the ConnectCore 8X System-on-module.
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The ConnectCore 8X System-on-module Power interfaces System-on-module power rails distribution The ConnectCore 8X requires three primary power supply inputs: VSYS, VSYS2, and VCC_MCA: n VSYS and VSYS2 are the input power supplies to the on-module NXP PF8100 Power Management IC (PMIC), as well as to most of its regulators. Some PMIC regulators are internally dedicated to powering the module, while others power external circuitry.
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The ConnectCore 8X System-on-module PMIC SoM power rail regulator name VSNVS VCC_SNVS_ LDO_1V8 Power interfaces Input power supply Internally Externally used available VSYS / VCC_ LICELL YES YES Comments An always-on power domain of the CPU that powers some core functionality of the SOM. Do not use this power rail externally. Note VCC_LICELL is the input power for the PMIC VSNVS regulator, which is normally used to power the CPU in low-power mode (RTC).
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The ConnectCore 8X System-on-module Power interfaces Input rail Device being powered Internal power domains being powered VDD_USDHC1 i.MX 8X CPU VDD_USDHC1_1P8_3P3 Input power supply for the USDHC1 interface. This interface is typically connected to a microSD socket, which also allows booting from the microSD card. Digi recommends that this power domain be connected to a flexible power supply (LDO3/4) so it can work at its highest speed by adjusting input voltage level. VDD_MIPI_DSI_DIG i.
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The ConnectCore 8X System-on-module Power interfaces Input rail Device being powered Internal power domains being powered VDD_ESAI_SPDIF i.MX 8X CPU VDD_ESAI_SPDIF_1P8_2P5_3P3 Input power supply for ESAI0 and SPDIF0 interfaces. VDD_SPI_SAI i.MX 8X CPU VDD_SPI_SAI_1P8_3P3 Input power supply for SAI0, SAI1, SPI0 and SPI2 interfaces. VDD_QSPI0B i.MX 8X CPU VDD_QSPI0B_1P8_3P3 Input power supply for QSPI0B interface. VDD_CSI i.
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The ConnectCore 8X System-on-module Power interfaces Input voltage (V) Minimum Typical Maximum Device SOM power rail LDO3IN 2.51 - 5.5 LDO4IN 2.51 - 5.5 MCA VCC_MCA 2.4 - 3.6 1.8 V mode 1.65 1.8 1.95 3.3 V mode 3.00 3.30 3.60 CPU VDD_USDHC1 VDD_MIPI_DSI_DIG VDD_ENET0 VDD_SPI_SAI VDD_QSPI0B VDD_CSI 1.8 V mode 1.65 1.8 3.60 VDD_ESAI_SPDIF 2.5 V mode 2.40 2.50 2.60 3.3 V mode 3.00 3.30 3.60 4.4 - 5.5 USB_OTG1_VBUS 1When VLDOx is greater than 2.
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The following table lists the electrical specifications of all output power rails for the ConnectCore 8X: Device PMIC SOM power rail Used internally in the SOM Output voltage (V) Accuracy (%) Min Typ Max Min Typ Max Max Turn-on time Turn-off time output (us) (us) current Min Typ Max Min Typ Max (mA) 1 SW6 1V8 YES - 1.80 - -2.0 - 2.0 2500 36 SW7 3V3 YES - 3.30 - -2.0 - 2.0 2500 - - LD01 VCC_SCU_1V8 YES - 1.80 - -3.0 - 3.0 400 - LD02 VDD_EMMC0 YES - 3.
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The ConnectCore 8X System-on-module Power interfaces System power-up sequence When the power supply is connected to the ConnectCore 8X module, the PMIC and the MCA are the first components to be powered up. VSYS and VSYS2 are PMIC supplies, while VCC_MCA is the Digi Microcontroller Assist input power line. The system power-up sequence is as follows: 1. The MCA starts to run as soon as it is powered up. After a certain programmable time, it will release the PWRON line of the PMIC (PMIC power on/off). 2.
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The ConnectCore 8X System-on-module Bootstrap RTC connection without coin cell charger RTC connection with coin cell charger Note This hardware configuration has been validated with the Panasonic DB2J31400L diode, which has a low reverse leakage current (300nA) that is ideal for this low-power mode application. Bootstrap The ConnectCore 8X module can be configured to boot from different devices and interfaces as determined by the Boot ROM.
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The ConnectCore 8X System-on-module BOOT_MODE [3] BOOT_MODE [2] Wireless interfaces BOOT_MODE [1] BOOT_MODE [0] Boot mode 0 0 0 1 USB serial download 0 0 1 0 USDHC Boot: eMMC0 0 0 1 1 USDHC Boot: USDHC1 0 1 0 0 NAND Boot: 128 pages in Block 0 1 0 1 NAND Boot: 32 pages in Block 0 1 1 0 FlexSPI Boot: 3B read 0 1 1 1 FlexSPI Boot: Hyperflash 3.0 These BOOT_MODE lines are referred to the VCC_SCU_1V8 power domain.
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The ConnectCore 8X System-on-module Mode Wireless interfaces Modulation & coding Rate 802.11ga BPSK-1/2 6 Mbps BPSK-3/4 9 Mbps QPSK-1/2 12 Mbps QPSK-3/4 18 Mbps 16QAM-1/2 24 Mbps 16QAM-3/4 36 Mbps 64QAM-2/3 48 Mbps 64QAM-3/4 54 Mbps BPSK-1/2 MCS0 QPSK-1/2 MCS1 QPSK-3/4 MCS2 16QAM-1/2 MCS3 16QAM-3/4 MCS4 64QAM-2/3 MCS5 64QAM-3/4 MCS6 64QAM-5/6 MCS7 802.11n 802.
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The ConnectCore 8X System-on-module Wireless interfaces Data rate (Mbps) VHT MCS index Modulation type Coding rate 20 MHz channel 40 MHz channel 80 MHz channel 800 ns GI 400 ns GI 800 ns GI 400 ns GI 800 ns GI 400 ns GI One spacial stream (requires 1 Tx antenna) 0 BPSK 1/2 6.5 7.2 13.5 15 29.3 32.5 1 QPSK 1/2 13 14.4 27 30 58.5 65 2 QPSK 3/4 19.5 21.7 40.5 45 87.8 97.5 3 16-QAM 1/2 26 28.9 54 60 117 130 4 16-QAM 3/4 39 43.3 81 90 175.
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The ConnectCore 8X System-on-module RF Ch. band BW 2.4 GHz 5 GHz Wireless interfaces Ch. spacing Channel number (Center freq.
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The ConnectCore 8X System-on-module Wireless interfaces 5 GHz band channels (20 MHz BW) Channel # Center frequency (MHz) EUROPE (ETSI) US (FCC) Canada (ISED) JAPAN 36 5180 Indoors ✔ ✔ ✔ 40 5200 Indoors ✔ ✔ ✔ 44 5220 Indoors ✔ ✔ ✔ 48 5240 Indoors ✔ ✔ ✔ 52 5260 Indoors / DFS / TPC DFS DFS DFS / TPC 56 5280 Indoors / DFS / TPC DFS DFS DFS / TPC 60 5300 Indoors / DFS / TPC DFS DFS DFS / TPC 64 5320 Indoors / DFS / TPC DFS DFS DFS / TPC 100 5500 DFS / TPC
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The ConnectCore 8X System-on-module Channel # Wireless interfaces Center frequency (MHz) EUROPE (ETSI) US (FCC) Canada (ISED) JAPAN 161 5805 SRD ✔ ✔ No Access 165 5825 SRD ✔ ✔ No Access Note DFS = Dynamic Frequency Selection TPC = Transmit Power Control SRD = Short Range Devices See Regulatory information for further details about available RF channels and their maximum transmit power.
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Transmit power The following tables list the maximum transmit power values for the ConnectCore 8X module. The values corresponds to the power configured for each antenna individually, so in MIMO applications total ouptut power will be the sum of both antennas. FCC RF band Channel BW Standard Output power (dBm) 2.4 GHz 5 GHz 20 MHz 802.11b 13.5 20 MHz 802.11g 17 20 MHz 802.11n 18 40 MHz 802.11n 12 20 MHz 802.11a 13 20 MHz 802.11n 12 20 MHz 802.11ac 12 40 MHz 802.11n 12 40 MHz 802.
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TELEC RF band Channel BW Standard Output power (dBm) 2.4 Gz 5 GHz 20 MHz 802.11b 10.5 20 MHz 802.11g 15 20 MHz 802.11n 15.5 40 MHz 802.11n 15 20 MHz 802.11a 13 20 MHz 802.11n 12 20 MHz 802.11ac 12 40 MHz 802.11n 12 40 MHz 802.11ac 12 80 MHz 802.11ac 11 Note The tables list the maximum output power for each standard, regulatory domain and bandwidth channel. Output power may be lower depending on the channel and modulation.
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Wireless variants ConnectCore® 8X System-on-Module Hardware Reference Manual -Preliminary 29
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Non-wireless variants The dedicated PCIe clock generator is not internally populated in the non-wireless variants, so to use the PCI Express interface it must be populated externally (see the ConnectCore 8X SBC Pro reference design). The following control lines can also be used externally in non-wireless variants: n PCIE_LGA_OUT_CTRL0_WAKE_B n PCIE_LGA_OUT_CTRL0_CLKREQ_B n PCIE_LGA_OUT_CTRL0_PERST_B Note There are other PCIe-related pads on the ConnectCore 8X module: F7, F8, F9, G20, G21, G23, G24.
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CryptoAuthentication device Antenna 1 supports both WLAN 2.4&5GHz and Bluetooth, and antenna 2 only supports WLAN 2.4&5GHz. CryptoAuthentication device The ConnectCore 8X module includes an Atmel CryptoAuthentication Device. This is a highly secure cryptographic co-processor with secure hardware-based key storage. It includes the following features: n Performs high-speed public key (PKI) algorithms (ECDSA and ECDH). NIST standard P256 elliptic curve support. n SHA-256 hash algorithm with HMAC option.
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The Digi Microcontroller Assist™ hardware n Advanced power management such as power key button, wake up sources, and PMIC control in low power. n Peripheral extensions such as RTC, watchdog, and tamper pins. The MCA and the i.MX 8X are connected through an I2C interface and an interrupt line. The microcontroller provides up to 19 general purpose IOs that can be configured with different modes to provide functionality such as digital input/output or ADC.
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The Digi Microcontroller Assist™ hardware n Releases the reset line of the CPU to allow starting the execution of the firmware on the i.MX 8X processor. Note The CPU reset line is also connected to the PMIC. The PMIC won't release this line until it is switched on and the entire starting sequence is finished (a few ms after the latest regulator is turned on). This means that even if the MCA releases the reset line before the PMIC is ready, the CPU won't go out of reset.
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The Digi Microcontroller Assist™ hardware MCA IO Pad LGA / castellated Digital IRQ 32KHz 1.
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The Digi Microcontroller Assist™ hardware Analog to digital converter Many of the MCA IOs can be configured as Analog to digital channels. The index of the MCA ADC channels corresponds to the index of the MCA IO. This means that ADC channel 1 corresponds to the MCA_IO1, ADC channel 2 to the MCA_IO2, and so on. The result of the ADC conversion for a given input voltage is inversely proportional to the reference voltage of the ADC. For the MCA ADCs, the reference voltage corresponds to the VCC_MCA voltage.
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The Digi Microcontroller Assist™ hardware Note The 32KHz clock output continues normal operation in low power modes (suspend and power off). Therefore, if the 32KHz clock output is enabled during normal operation but is not required for low power operation, Digi recommends using the software to disable it before entering low power in order to minimize power consumption, and re-enable it when resuming normal operation. Watchdog The MCA implements a watchdog timer in its firmware.
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The Digi Microcontroller Assist™ hardware PWM controller Number of channels Channel IO PWM0 PWM1 PWM2 6 2 2 0 MCA_IO0 1 MCA_IO12 2 MCA_IO15 3 MCA_IO16 4 MCA_IO17 5 MCA_IO18 0 MCA_IO5 1 MCA_IO6 0 MCA_IO7 1 MCA_IO8 On the ConnectCore 8X: n All MCA PWM channels are available on the LGA pads. n PWM0 channel 0 is available on the castellated pads. n PWM1 channels 0 and 1 are available on the castellated pads. n PWM2 channels 0 and 1 are available on the castellated pads.
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The Digi Microcontroller Assist™ hardware W4PK mode You can configure boot mode using the mca_config_tool –boot_mode option. If ‘boot on power’ (BOP) is chosen, the module will enter in ON state as soon as power is applied.
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The Digi Microcontroller Assist™ hardware If ‘wait for power key’ (W4PK) is chosen, the module will wait for a PWR_IO press before entering in ON state when power is applied. ON/RUN mode In this mode, the PMIC is running at full power so all voltage regulators are generating the nominal voltage for this mode. The CPU reset line is de-asserted and the processor is running at normal speed, performing DVFS if the system was configured to do so.
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The Digi Microcontroller Assist™ hardware provides a configurable debounce filter to improve noise immunity and filter rebounds on push buttons. When the PWR_IO signal is asserted low, one of the following events occurs: n If the duration of the assertion is short (time configurable by the user) the system will trigger an interrupt that, commonly, indicates the host processor that the system should enter suspend state.
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IOMUX IOMUX The following sections describe the pin multiplexing (IOMUX) of the ConnectCore 8X Note The Digi ConnectCore Smart IOmux tool can dramatically simplify pin configuration and resolution. You can enter the list of interfaces required by your project and use the Smart IOmux graphical interface to mock up configuration options, resulting in full pin assignment and device tree snippets that match your desired functionality.
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IOMUX Module pinout Module pinout The ConnectCore 8X System-on-module has a mixed pad structure. It provides 474 LGA pads and 118 peripheral castellated pads. The general layout can be found on the following diagram: Note This diagram represents the module as seen from the top side with antennas on top.
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The following table lists the I/O multiplexing (IOMUX) of the ConnectCore 8X System-on-module. Most of the castellated pads are associated with (connected to) an LGA pad; this relationship is highlighted in the "Associated LGA Pad name" column. IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary IOMUX table The microprocessor used on this module, like all CMOS devices, can be driven into a latch-up condition if any I/O pin is driven outside of its associated power rail.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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Associated LGA Pad name ConnectCore 8X signal name 17 V1 18 IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # i.
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Associated LGA Pad name 23 AD1 ConnectCore 8X signal name MIPI_DSI1_GPIO0_ 00 IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.MX 8X pin name* Multiplexing Power group Comments 55 AN24 SWD_CLK/PWR_IO - ALT0: ALT1: PTA0 ALT2: ALT3: TPM0_CH5 ALT4: ALT5: ALT6: ALT7: SWD_CLK VCC_MCA Input power ON/OFF line of the module (active low). 56 AN25 SYS_RESET - - VCC_MCA Input reset line of the module (active low).
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Castellated pad # Associated LGA Pad name ConnectCore 8X signal name i.
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IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary Extended LGA version i.
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i.MX 8X pad name* Multiplexing Power Group Comments C3 RF_ANT2_INT - - - Internal secondary antenna pad.
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Multiplexing Power Group Comments D5 WLAN_SD1_D3 - - 3V3_RF This SDIO interface is connected to the Wireless chip on the wireless variants of the SOM. By default, the QCA chip carried by the SOM will use the internal PCIe interface, not the SDIO. D6 WLAN_SD1_D2 - - 3V3_RF D7 WLAN_SD1_D7 - - 3V3_RF D8 WLAN_SD1_D1 - - 3V3_RF D9 WLAN_SD1_D0 - - 3V3_RF D10 WLAN_SD1_D6 - - 3V3_RF 66 Extended LGA version i.
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Multiplexing Power Group Comments E13 BT_UART1_TX UART1_TX ALT0: UART1_TX ALT1: PWM0_OUT ALT2: GPT0_CAPTURE ALT3: ALT4: GPIO0_IO21 3V3/3V3_RF Internal UART line used by the Bluetooth. This signal is externally available only in nonwireless variants.
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i.MX 8X pad name* Multiplexing Power Group E26 SPI0_CS1 SPI0_CS1 ALT0: ALT1: ALT2: ALT3: ALT4: VDD_SPI_SAI F2 VDD_PCIE_DIG - - VDD_PCIE_DGI/3V3_RF F4 PCIE_LGA_OUT_CTRL0_WAKE_ B ALT0: PCIE_CTRL0_WAKE_B ALT4: GPIO4_IO02 VDD_PCIE_DIG Internal PCIe line used by the wireless. This signal is externally available only in nonwireless variants. F5 PCIE_LGA_OUT_CTRL0_ CLKREQ_B ALT0: PCIE_CTRL0_CLKREQ_ B ALT4: GPIO4_IO01 VDD_PCIE_DIG Internal PCIe line used by the wireless.
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i.MX 8X pad name* Multiplexing Power Group Comments F6 PCIE_LGA_OUT_CTRL0_ PERST_B - ALT0: PCIE_CTRL0_PERST_B ALT4: GPIO4_IO00 VDD_PCIE_DIG Internal PCIe line used by the wireless. This signal is externally available only in nonwireless variants. F7 PCIE_LGA_IN_CTRL0_WAKE_B - - VDD_PCIE_DIG Leave this pin floating unless otherwise noted. F8 PCIE_LGA_IN_CTRL0_ CLKREQ_B - - VDD_PCIE_DIG Leave this pin floating unless otherwise noted.
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Multiplexing Power Group Comments F10 3V3_RF_EN QSPI0A_DATA3 ALT0: QSPI0A_DATA3 ALT4: GPIO3_IO12 3V3 In Wireless variants of the SOM this is a reserved output line. Do not drive this signal externally. F11 BT_UART1_RTS# UART1_RTS_B ALT0: ALT1: ALT2: ALT3: ALT4: UART1_RTS_B PWM2_OUT LCDIF_D16 GPT1_CAPTURE GPTO_CLK 3V3/3V3_RF Internal UART line used by the Bluetooth. This signal is externally available only in nonwireless variants.
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Multiplexing Power Group F15 GND - - - F16 GND - - - F17 3V3_RF - - 3V3_RF F18 3V3_RF - - 3V3_RF F19 RESERVED - - - F20 RESERVED - - - F21 GND - - - F22 GND - - - F23 QOW - - 3V3_RF F24 WLAN_LED - - 3V3_RF Functionality not supported. F25 BT_LED - - 3V3_RF Functionality not supported. F26 BT_EN QSPI0A_DATA1 ALT0: QSPI0A_DATA1 ALT4: GPIO3_IO10 3V3_RF In wireless variants of the SOM, this is a reserved output line.
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i.MX 8X pad name* Multiplexing Power Group Comments F27 WL_EN QSPI0A_DATA2 ALT0: QSPI0A_DATA2 ALT4: GPIO3_IO11 3V3_RF In wireless variants of the SOM, this is a reserved output line. Do not drive this signal externally.
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Multiplexing Power Group Comments G7 PCIE0_LGA_OUT_RX0_P - - 1V8 Internal PCIe line used by the Wireless. This signal is externally available only in nonwireless variants. G8 GND - - - G9 PCIE0_LGA_OUT_TX0_N - - 1V8 Internal PCIe line used by the Wireless. This signal is externally available only in nonwireless variants. G10 PCIE0_LGA_OUT_TX0_P - - 1V8 Internal PCIe line used by the Wireless. This signal is externally available only in nonwireless variants.
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i.MX 8X pad name* Multiplexing Power Group G11 GND - - - G12 BT_WAKEUP_SLAVE - - 3V3_RF G13 PCM_CLK - - 3V3_RF G14 PCM_IN - - 3V3_RF G15 LTE_ACTIVE - - 3V3_RF G16 GND - - - G17 BT_WAKEUP_HOST - - 3V3_RF G18 WLAN_SDIO_INT_L - - 3V3_RF G19 GND - - - G20 PCIE0_LGA_IN_TX0_P - - 1V8 Leave this pin floating unless otherwise noted. G21 PCIE0_LGA_IN_TX0_N - - 1V8 Leave this pin floating unless otherwise noted.
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Multiplexing Power Group Comments G24 PCIE0_LGA_IN_RX0_N - - 1V8 Leave this pin floating unless otherwise noted. G25 GND - - - G26 GND - - - G27 GND - - - G28 GND - - - H2 GND - - - H3 GND - - - H4 GND - - - H5 GND - - - H6 GND - - - H7 GND - - - H8 GND - - - H9 GND - - - H10 GND - - - H11 GND - - - H12 GND - - - H13 GND - - - H14 GND - - - 79 Extended LGA version i.
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Multiplexing Power Group H15 GND - - - H16 GND - - - H17 GND - - - H18 GND - - - H19 GND - - - H20 GND - - - H21 GND - - - H22 GND - - - H23 GND - - - H24 GND - - - H25 GND - - - H26 GND - - - H27 GND - - - H28 GND - - - AF2 GND - - - AF3 GND - - - AF4 GND - - - AF5 GND - - - AF6 GND - - - AF7 GND - - - Comments 80 Extended LGA version i.
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Multiplexing Power Group AF8 GND - - - AF9 GND - - - AF10 GND - - - AF11 GND - - - AF12 GND - - - AF13 GND - - - AF14 GND - - - AF15 GND - - - AF16 GND - - - AF17 GND - - - AF18 GND - - - AF19 GND - - - AF20 GND - - - AF21 GND - - - AF22 GND - - - AF23 GND - - - AF24 GND - - - AF25 GND - - - AF26 GND - - - AF27 GND - - - Comments 81 Extended LGA version i.
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Multiplexing Power Group AG20 JTAG_TCK JTAG_TCK - VCC_SCU_1V8 AG21 JTAG_TDO JTAG_TDO - VCC_SCU_1V8 AG22 VDD_CSI - - VDD_CSI AG23 GND - - - AG24 VDD_ADC_1V8 - - VDD_ADC_1V8 AG25 ADC_IN4 ADC_IN4 ALT0: ADC_IN4 ALT1: M40_TPM_CH0 ALT2: M40_GPIO0_IO04 ALT3: ALT4: GPIO1_IO14 1V8 AG26 ADC_IN3 ADC_IN3 ALT0: ALT1: ALT2: ALT3: ALT4: ADC_IN3 M40_UART0_TX M40_GPIO0_IO03 MCLK_OUT0 GPIO1_IO11 1V8 AG27 ADC_IN2 ADC_IN2 ALT0: ALT1: ALT2: ALT3: ALT4: ADC_IN2 M40_UART0_RX M40_GPIO0_IO0
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Multiplexing Power Group AH4 GND - - - AH5 GND - - - AH6 PMIC_FSOB - - AH7 LDO4 - - LDO4 AH8 GND - - - AH9 LDO4IN - - - AH10 POR_B - - VCC_SCU_1V8 AH11 PMIC_EWARN - - AH12 PMIC_WDI - - AH13 VLDO2_VSELECT - - AH14 GND - - - AH15 MIPI_DSI1_DATA2_P MIPI_DSI1_DATA2_P - NVCC_MIPI_CSI_DSI AH16 MIPI_DSI1_DATA2_N MIPI_DSI1_DATA2_N - NVCC_MIPI_CSI_DSI Comments Reset signal of the CPU. Digi recommends leaving this pin floating.
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i.MX 8X pad name* Multiplexing AJ12 - - PWR_ON Power Group Comments IOMUX ConnectCore® 8X System-on-Module Hardware Reference Manual -- Preliminary LGA pad name ConnectCore 8X signal name Power on/off signal of the SOM: n ON: high level. n OFF: low level. 2.2M pull-up on module connected to VCC_MCA.
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Multiplexing Power Group AJ21 CSI_MCLK CSI_MCLK ALT0: CSI_MCLK ALT1: MIPI_CSI0_I2C0_SDA ALT2: ALT3: SPI1_SDO ALT4: GPIO3_IO01 VDD_CSI AJ22 CSI_D07 CSI_D07 ALT0: CSI_D09 ALT1: ALT2: SAI3_RXD ALT3: TAMPER_IN2 ALT4: VDD_CSI AJ23 CSI_D04 CSI_D04 ALT0: CSI_D06 ALT1: ALT2: SAI2_RXD ALT3: TAMPER_OUT4 ALT4: VDD_CSI AJ24 CSI_D05 CSI_D05 ALT0: CSI_D07 ALT1: ALT2: SAI2_RXFS ALT3: TAMPER_IN0 ALT4: VDD_CSI AJ25 CSI_D02 CSI_D02 ALT0: CSI_D04 ALT1: ALT2: SAI0_RXFS ALT3: TAMPER_OUT2 ALT4: VDD_CSI
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Multiplexing Power Group AK3 VSYS2 - - VSYS2 AK4 VSYS2 - - VSYS2 AK5 GND - - - AK6 GND - - - AK7 GND - - - AK8 GND - - - AK9 GND - - - AK10 GND - - - AK11 GND - - - AK12 GND - - - AK13 GND - - - AK14 GND - - - AK15 MIPI_DSI1_DATA1_N MIPI_DSI1_DATA1_N - NVCC_MIPI_CSI_DSI AK16 MIPI_DSI1_DATA1_P MIPI_DSI1_DATA1_P - NVCC_MIPI_CSI_DSI AK17 GND - - - AK18 MIPI_DSI1_DATA3_P MIPI_DSI1_DATA3_P - NVCC_MIPI_CSI_DSI AK19 MIPI_DSI1_DATA3_
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Multiplexing Power Group AK23 GND - - - AK24 MIPI_CSI0_I2C0_SDA MIPI_CSI0_I2C0_SDA ALT0: MIPI_CSI0_I2C0_SDA ALT1: MIPI_CSI0_GPIO0_ IO03 ALT2: ALT3: ALT4: GPIO3_IO06 1V8 AK25 MIPI_CSI0_I2C0_SCL MIPI_CSI0_I2C0_SCL ALT0: MIPI_CSI0_I2C0_SCL ALT1: MIPI_CSI0_GPIO0_ IO02 ALT2: ALT3: ALT4: GPIO3_IO05 1V8 AK26 CSI_RESET CSI_RESET ALT0: ALT1: ALT2: ALT3: ALT4: CSI_RESET CSI_I2C_SDA I2C3_SDA SPI1_CS0 GPIO3_IO03 VDD_CSI AK27 CSI_EN CSI_EN ALT0: ALT1: ALT2: ALT3: ALT4: CSI_EN CSI_I2C_SCL I2C3_
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Multiplexing Power Group AL3 3V3 - - 3V3 AL4 GND - - - AL5 GND - - - AL6 VSYS - - VSYS AL7 VSYS - - VSYS AL8 VSYS - - VSYS AL9 GND - - - AL10 GND - - - AL11 GND - - - AL12 MIPI_CSI0_DATA1_P MIPI_CSI0_DATA1_P - NVCC_MIPI_CSI_DSI AL13 MIPI_CSI0_DATA1_N MIPI_CSI0_DATA1_N - NVCC_MIPI_CSI_DSI AL14 GND - - - AL15 MIPI_CSI0_DATA0_P MIPI_CSI0_DATA0_P - NVCC_MIPI_CSI_DSI AL16 MIPI_CSI0_DATA0_N MIPI_CSI0_DATA0_N - NVCC_MIPI_CSI_DSI AL17 GND -
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Module specifications Module specifications The following sections describe the specifications for the ConnectCore 8X System-on-module.
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Module specifications Power consumption Power consumption This section contains information about the power consumption of the ConnectCore 8X System-onmodule. All measurements were performed on the ConnectCore 8X SBC platform running Digi Embedded Yocto. All presented results were measured at ambient temperature (25ºC). Note These power consumption numbers should be considered guidelines only, never as fixed or absolute values.
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Module specifications Power consumption CoreMark & Dhrystone CoreMark and Dhrystone are benchmark tools that measure the performance of central processing units (CPU) in embedded systems. GLMARK2 Glmark2 is a benchmark tool that measures many aspects of OpenGL (ES) 2.0 performance. Dual Video Play The Dual Video Play benchmark tool measures the performance of the system when displaying video through both LVDS.
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Module specifications Environmental specifications Environmental specifications n Operating temperature: -40 to 85 C. CAUTION! Your final product may require additional thermal management such as passive (heatsink/spreader) or active (airflow) cooling to achieve the maximum operating temperature without exceeding the processor junction temp limit. n The ConnectCore 8X module shall be built in an enclosure so the shield is not accessible to the end user.
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Assembly instructions Moisture sensitivity and shelf life Mounting Coplanarity Solder paste print Stencil SMT pick and place SMT process parameter reference Reflow profile ConnectCore® 8X System-on-Module Hardware Reference Manual -Preliminary 102 102 102 102 102 103 103 103 101
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Assembly instructions Moisture sensitivity and shelf life Moisture sensitivity and shelf life The ConnectCore 8X system-on-module module is classified as a Level 3 Moisture Sensitive Device in accordance with IPC/JEDEC J-STD-020. 1. Calculated shelf life in sealed packaging: 12 months at <40°C and <90% relative humidity (RH). 2. Environmental condition during production: 30°C / 60% RH according to IPC/JEDEC J-STD-033C paragraph 5. 3.
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Assembly instructions SMT pick and place SMT pick and place n Placement nozzle: Largest available on the machine n Nozzle pick surface: Center of shield n Placement speed: Slowest speed for the machine n Placement alignment: 10% of pad diameter (compensating for module weight and supporting alignment). The module should be placed last as part of the assembly/mounting process to eliminate unexpected shifting.
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Assembly instructions Reflow profile Digi recommends you use two (2) thermocouple locations to achieve proper attachment of SoM: n Attach thermocouple to bottom of SoM located in the center of the cutout with the thermocouple touching the SoM. n Drill hole through bottom of carrier PCB near corner of SoM deep enough to reach SoM. n Insert thermocouple into hole touching SoM and secure. Digi recommends X-ray analysis after reflow to confirm proper mounting and solder reflow.
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Regulatory information and certifications Note The ConnectCore 8X module complies with Part 15 of the United States FCC rules and regulations. Other certifications are currently pending.
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Regulatory information and certifications United States FCC United States FCC The ConnectCore 8X module complies with Part 15 of the FCC rules and regulations. Compliance with the labeling requirements, FCC notices and antenna usage guidelines is required. To fulfill FCC Certification, the OEM must comply with the following regulations: The system integrator must ensure that the text on top side of the module is placed on the outside of the final product.
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Regulatory information and certifications RF band United States FCC Peak antenna gain Technology Frequencies WLAN [BW 20 MHz] x 11 overlapping channels, # (center freq. MHz): * [2400 - 2473 MHz]: 1 (2412), 2 (2417), 3 (2422), 4 (2427), 5 (2432), 6 (2437),7 (2442), 8 (2447), 9 (2452), 10 (2457), 11 (2462) [BW 40 MHz] x 7 overlapping channels, # (center freq. MHz): * [2400 - 2473 MHz]: 3 (2422), 4 (2427), 5 (2432), 6 (2437),7 (2442), 8 (2447), 9 (2452) 2.4 GHz 4.
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Regulatory information and certifications United States FCC IMPORTANT: This module has been tested and found to comply with the following requirements for Modular Approval. Part 15.247 - Operation within the bands 902-928 MHz, 2400-2483.5 MHz, and 5725-5850 MHz. Part 15.407 – General technical requirements. FCC-approved antennas The ConnectCore 8X can be installed utilizing antennas and cables constructed with non-standard connectors (RPSMA, RPTNC, and so on).
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Regulatory information and certifications Antenna type Supplier Antenna part no. PCB TAOGLAS FXP522.A.07.A.001 Dipole PCB PCB Linx ANT-DB1-RAF-RPS Ethertronic 1001932 TAOGLAS FXP831.07.0100C United States FCC Freq. (MHz) Peak antenna gain (dBi) Directional gain (dBi) 2402~2480 3.78 (Port 1) 3.15 (Port 2) 6.79 5150~5250 4.63 (Port 1) 4.61 (Port 2) 7.64 5250~5350 4.63 (Port 1) 4.61 (Port 2) 7.64 5470~5725 4.63 (Port 1) 4.61 (Port 2) 7.64 5725~5850 4.63 (Port 1) 4.61 (Port 2) 7.
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Regulatory information and certifications Europe RF exposure CAUTION! To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20 cm (8 in) or more should be maintained between the antenna of this device and persons during device operation. To ensure compliance, operations at closer than this distance are not recommended. The antenna used for this transmitter must not be co-located in conjunction with any other antenna or transmitter.
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Regulatory information and certifications Europe CE labeling requirements The CE mark shall consist of the initials CE taking the following form: n If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be respected. n The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus. n The CE marking must be affixed visibly, legibly, and indelibly.
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Regulatory information and certifications Canada (IC) Canada (IC) IC: 1846A-CCIMX8 PMN: CC8X HVIN: ConnectCore 8X Canadian Notice This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: 1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device.
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Regulatory information and certifications Japan equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada.
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Regulatory information and certifications n 2.412 to 2.472 GHz; 13 channels n 5.180 to 5.320 GHz; 8 channels n 5.500 to 5.700 GHz; 11 channels Japan Approval Label (MIC Marking) Label text Note Due to space constraints, the ConnectCore 8X module label doesn’t support radio marking for Japan. If space allows, end product label should support radio marking for Japan. If not, radio marking shall be documented in the user manual.