Users Manual

DA16600MOD Series
Ultra-Low Power WiFi + BLE Combo Module
NDA Confidential
Datasheet
Revision 1.1
15-July-2020
CFR0011-120-00
4 of 26
© 2020 Dialog Semiconductor
Contents
General Description ............................................................................................................................ 1
Module Features .................................................................................................................................. 1
Wi-Fi Features ...................................................................................................................................... 1
Bluetooth Features .............................................................................................................................. 2
1 References ..................................................................................................................................... 5
2 Block Diagram ............................................................................................................................... 6
3 Pinout ............................................................................................................................................. 7
3.1 Pin-out Description (51-pins) ................................................................................................ 7
4 Electrical Specification ................................................................................................................. 9
4.1 Absolute Maximum Ratings .................................................................................................. 9
4.2 Recommended Operating Conditions ................................................................................. 10
4.3 Electrical Characteristics ..................................................................................................... 10
4.3.1 DC Parameters, 1.8V IO ...................................................................................... 10
4.3.2 DC Parameters, 3.3V IO ...................................................................................... 10
4.4 Radio Characteristics .......................................................................................................... 11
4.4.1 WLAN Characteristics .......................................................................................... 11
4.4.2 BLE Characteristics ............................................................................................. 12
4.5 Current Consumption .......................................................................................................... 15
4.5.1 WLNA Characteristics .......................................................................................... 15
4.5.2 BLE characteristics .............................................................................................. 15
4.6 Radiation Performance ....................................................................................................... 16
4.7 ESD Ratings ........................................................................................................................ 16
5 Applications Schematic .............................................................................................................. 17
5.1 Typical Application .............................................................................................................. 17
6 Package Information ................................................................................................................... 19
6.1 Dimension: DA16600MOD-AAC ......................................................................................... 19
6.2 Dimension: DA16600MOD-AAE ......................................................................................... 20
6.3 PCB Land Pattern ............................................................................................................... 21
6.4 Soldering Information .......................................................................................................... 22
6.4.1 Recommended Condition for Reflow Soldering .................................................. 22
7 Ordering Information .................................................................................................................. 24
Revision History ................................................................................................................................ 25