Users Manual

DA16600MOD Series

Ultra-Low Power WiFi + BLE Combo Module

NDA Confidential

Datasheet

Revision 1.1

15-July-2020

CFR0011-120-00

22 of 26

6.4 Soldering Information

6.4.1 Recommended Condition for Reflow Soldering

Figure 11 shows the typical process flow for mounting surface mount packages to PCB.

The reflow profile depends on the solder paste being used and the recommendations from the paste

manufacture should be followed to determine the proper reflow profile. Figure 11 shows a typical

reflow profile when a no-clean paste is used. Oven time above liquidus (260 °C for lead-free solder)

is 20 to 40 seconds.

The rework process involves the following steps:

1. Component removal

2. Site redress

3. Solder paste application

4. Component placement

5. Component attachment

Figure 11: Typical PCB Mounting Process Flow