User's Manual

Table Of Contents
SC14CVMDECT SF Cordless Voice Module
© 2012 Dialog Semiconductor B.V. 47 July 1, 2014 v1.6
10.3 COPPER PAD, SOLDER OPENING AND STEN-
CIL
For the stencil a thickness of 0.122 mm is recom-
mended. Recommended copper pad, solder mask
opening and stencil are shown below.
Figure 40 Pad dimensions