User's Manual
Table Of Contents
- 1.0 Connection diagram
- 2.0 Introduction
- 3.0 Cordless Voice Module functionality
- 4.0 Functional description
- 5.0 CAT-iq
- 6.0 Specifications
- 6.1 General
- 6.2 Absolute Maximum ratings
- 6.3 Operating Conditions
- 6.4 Digital Input/Output Pins
- 6.5 Analog Front End
- Table 11: Microphone amplifier
- Table 12: Microphone amplifier (Operating Condition)
- Table 13: Microphone supply voltages
- Table 14: VREFp load circuit
- Table 15: LSRp/LSRn outputs
- Table 16: LSRp/LSRn load circuits
- Table 17: PAOUTp, PAOUTn outputs
- Table 18: PAOUTp, PAOUTn outputs (Note 19)
- Table 19: PAOUTp, PAOUTn external components
- 6.6 Battery management
- 6.7 Baseband Part
- 6.8 Radio (RF) Part
- 6.9 RF Power supply
- 6.10 RF channel frequencies
- 7.0 Design guidelines
- 8.0 Example Application Diagram
- 9.0 Notices to OEM
- 10.0 Package information
- 11.0 Revision history
SC14CVMDECT SF Cordless Voice Module
© 2012 Dialog Semiconductor B.V. 46 July 1, 2014 v1.6
10.0 Package information
10.1 SOLDERING PROFILE
The SC14CVMDECT SF should be soldered using a
standard reflow soldering profile and lead free solder
paste as shown below. Adjustments to the profile may
be necessary depending on process requirements.
10.2 MOISTURE SENSITIVITY LEVEL (MSL)
The MSL is an indicator for the maximum allowable
time period (floor life time) in which a moisture sensi-
tive plastic device, once removed from the dry bag, can
be exposed to an environment with a maximum tem-
perature of 30°C and a maximum relative humidity of
60% RH. before the solder reflow process.
The SC14CVMDECT SF is qualified to MSL 3.
Figure 39 Reflow profile
MSL Level Floor Life Time
MSL 4 72 hours
MSL 3 168 hours
MSL 2A 4 weeks
MSL 2 1 year
MSL 1 Unlimited at 30°C/85%RH