User's Manual

SC14CVMDECT SF Cordless Voice Module
© 2012 Dialog Semiconductor B.V. 3 July 1, 2014 v1.6
Table of Contents
42
7.5 PATTERN FOR PIN 79 ON THE MAIN BOARD.
42
7.6 PRECAUTIONS REGARDING UNINTENDED
COUPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.0 Example Application Diagram. . . . . . . . . . . . . . . 43
9.0 Notices to OEM. . . . . . . . . . . . . . . . . . . . . . . . . . . 44
9.1 FCC REQUIREMENTS REGARDING THE END
PRODUCT AND THE END USER. . . . . . . . . . 44
9.2 IC REQUIREMENTS REGARDING THE END
PRODUCT AND THE END USER . . . . . . . . . 44
9.3 PRECAUTIONS REGARDING UNINTENDED
COUPLING . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
9.4 END APPLICATION APPROVAL . . . . . . . . . . 45
9.5 SAFETY REQUIREMENTS . . . . . . . . . . . . . . 45
10.0 Package information . . . . . . . . . . . . . . . . . . . . . 46
10.1 SOLDERING PROFILE . . . . . . . . . . . . . . . . . 46
10.2 MOISTURE SENSITIVITY LEVEL (MSL) . . . 46
10.3 COPPER PAD, SOLDER OPENING AND
STENCIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
10.4 MECHANICAL DIMENSIONS . . . . . . . . . . . . 49
11.0 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 50