User's Manual
Table Of Contents
- 1.0 Connection Diagram
- 2.0 Introduction
- 3.0 Cordless Voice Module functionality
- 4.0 Functional description
- 5.0 CAT-iq
- 6.0 Specifications
- 7.0 Design guidelines
- 8.0 Audio Level Adjustment
- 9.0 Example Application Diagram
- 10.0 Mechanical Dimensions
- 11.0 Module integration
- 12.0 UTAM membership waiver
- 13.0 Soldering
- 14.0 Notices to OEM
SC14CVMDECT Cordless Voice Module
© 2011 SiTel Semiconductor B.V. Company Confidential 43 August 19, 2011 v1.2.1
13.3 STENCIL
For the stencil a thickness of 0.122 mm is
recommended. Recommended opening is as shown
below.
Figure 30 Copper pad and Solder mask opening
C
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p
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mm
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m
Substrate
Copper pads
Solder Mask
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1
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0
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0
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8
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8
0
Figure 31 Stencil
Stencil
Opening in stencil 1.40 x 1,40mm
0.80x0.80