User's Manual
Table Of Contents
- 1.0 Connection Diagram
- 2.0 Introduction
- 3.0 Cordless Voice Module functionality
- 4.0 Functional description
- 5.0 CAT-iq
- 6.0 Specifications
- 7.0 Design guidelines
- 8.0 Audio Level Adjustment
- 9.0 Example Application Diagram
- 10.0 Mechanical Dimensions
- 11.0 Module integration
- 12.0 UTAM membership waiver
- 13.0 Soldering
- 14.0 Notices to OEM
SC14CVMDECT Cordless Voice Module
© 2011 SiTel Semiconductor B.V. Company Confidential 42 August 19, 2011 v1.2.1
13.0 Soldering
13.1 SOLDERING PROFILE
The SC14CVMDECT should be soldered using a
standard reflow soldering profile and lead free solder
paste as shown below. Adjustments to the profile may
be necessary depending on process requirements.
13.2 COPPER PAD AND SOLDER OPENING
Recommended Copper Pad and Solder Mask Opening
(NSMD).
Figure 29 Reflow profile
t1: Max. Change in temperature
3°C/sec.
t2: Time in preheat (150°C < temp.
< 190°C)
60 -
120 sec.
t3: Time in reflow zone (temp. > 220°C) 30 -
60 sec.
t4: Peak temperature
237°C±5°C
T1 Preheat zone botto
m
150°C
T2 Preheat zone top 190°C
T3 Reflow zone 220°C
0°
T1 150°C
T2 190°C
T3 220°C
50°
t1
t2
Meltingpoint 217°C
150°
100°
250°
200°
Reflow profile – leadfree
Sn96.5-Ag3.0-Cu0.5
t3
t4
Temp. C°
Time