Data Sheet
Table Of Contents
- General Description
- Key Features
- Applications
- Contents
- Figures
- Tables
- 1 References
- 2 Block Diagram
- 3 Pinout
- 4 Characteristics
- 5 Mechanical Specifications
- 6 Packaging Information
- 7 Application Information
- 8 Design Guidelines
- 9 Soldering
- 10 Ordering Information
- 11 Regulatory Information
- 12 Environmental Information
- 13 Bluetooth SIG Qualification
- Revision History
DA14531MOD
SmartBond TINY
TM
Module
Preliminary
Datasheet
Revision 2.1
4-June-2020
CFR0011-120-00
6 of 31
© 2020 Dialog Semiconductor
2 Block Diagram
SmartBond TINY™ module is based on the Dialog Semiconductor DA14531 SoC configured in buck
mode. With an integrated 1Mbit flash, 32MHz XTAL and a printed antenna, it allows faster time to
market at reduced development cost.
The module, as seen in Figure 1, comprises of:
- 1 Mbit SPI FLASH
- 32MHz XTAL
- 2 decoupling capacitors
- a power inductor
- a CLC filter and matching components for the printed antenna.
PROJECT
NAME
10uF
DA14531
2.2uH
2.2uF
P25Q11U
1Mbit
NOR-SPI
Data Flash
P0_0
P0_1
P0_3
P0_4
P0_2
P0_5
P0_6
P0_7
P0_8
P0_9
P0_10
P0_11
32MHz
RF Filter &
Matching
VBAT_LOW
VBAT_HIGH
Lx
GND
VBAT
J12 (RST)
J10
J14
J5
J13
J16
J15
J9
J8
J2, J3, J4,
J6, J11, (J1)
J7
Figure 1: SmartBond TINY Module Block Diagram
SmartBond TINY™ is fully certified across regions.