Data Sheet

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Table Of Contents

DA14531MOD

SmartBond TINY

Module

Preliminary

Datasheet

Revision 2.1

4-June-2020

CFR0011-120-00

3 of 31

Contents

General Description ........................................................................................................................... 1

Key Features ....................................................................................................................................... 1

Applications ........................................................................................................................................ 2

1 References .................................................................................................................................... 5

2 Block Diagram .............................................................................................................................. 6

3 Pinout ............................................................................................................................................ 7

4 Characteristics ............................................................................................................................. 9

4.1 Absolute Maximum Ratings.................................................................................................. 9

4.2 Recommended Operating Conditions ................................................................................ 10

4.3 Device Characteristics........................................................................................................ 10

5 Mechanical Specifications ......................................................................................................... 13

5.1 Dimensions ........................................................................................................................ 13

5.2 PCB Footprint ..................................................................................................................... 14

5.3 Marking .............................................................................................................................. 14

6 Packaging Information ............................................................................................................... 15

6.1 Tape & Reel ....................................................................................................................... 15

6.2 Labeling.............................................................................................................................. 16

7 Application Information ............................................................................................................. 16

8 Design Guidelines ...................................................................................................................... 16

8.1 Placement .......................................................................................................................... 17

8.2 Antenna graphs .................................................................................................................. 18

8.3 Radiation pattern ................................................................................................................ 19

9 Soldering ..................................................................................................................................... 21

10 Ordering Information ................................................................................................................. 23

11 Regulatory Information .............................................................................................................. 23

11.1 CE (Radio Equipment Directive 2014/53/EU (RED)) - (Europe) ......................................... 24

11.2 FCC - (U.S.A.) .................................................................................................................... 24

11.3 IC (CANADA) ..................................................................................................................... 25

11.4 MIC (JAPAN) ...................................................................................................................... 26

11.5 NCC (Taiwan) .................................................................................................................... 26

11.6 MSIP (South Korea) ........................................................................................................... 27

11.7 Australia/ New Zealand (RCM) ........................................................................................... 27

11.8 South Africa (ICASA) ......................................................................................................... 27

11.9 Brazil (Anatel) ..................................................................................................................... 28

11.10 China (SRRC) .................................................................................................................... 28

11.11 Thailand (NBTC) ................................................................................................................ 28

12 Environmental Information ........................................................................................................ 29

13 Bluetooth SIG Qualification ....................................................................................................... 29

Revision History ............................................................................................................................... 30