Data Sheet
Table Of Contents
- General Description
- Key Features
- Applications
- Contents
- Figures
- Tables
- 1 References
- 2 Block Diagram
- 3 Pinout
- 4 Characteristics
- 5 Mechanical Specifications
- 6 Packaging Information
- 7 Application Information
- 8 Design Guidelines
- 9 Soldering
- 10 Ordering Information
- 11 Regulatory Information
- 12 Environmental Information
- 13 Bluetooth SIG Qualification
- Revision History
DA14531MOD
SmartBond TINY
TM
Module
Preliminary
Datasheet
Revision 2.1
4-June-2020
CFR0011-120-00
10 of 31
© 2020 Dialog Semiconductor
4.2 Recommended Operating Conditions
Table 3: Recommended Operating Conditions
Parameter
Description
Conditions
Min
Typ
Max
Unit
V
BAT
battery supply voltage
enabling FLASH
programming
1.65
3.3
V
V
PIN
voltage on a pin
-0.1
3.3
V
T
A
ambient operating
temperature
-40
27
85
°C
4.3 Device Characteristics
Table 4: DC Characteristics
Parameter
Description
Conditions
Min
Typ
Max
Unit
I
BAT_ACTIVE
battery supply current with
CPU running CoreMark from
RAM at 16MHz
0.4
mA
I
BAT_BLE_ADV_
100ms
Average battery supply
current with system in
Advertising state (3
channels) every 100ms and
extended sleep with all RAM
retained. TX output power at
2dBm. FLASH is off.
80
μA
I
BAT_BLE_CON
N_30ms
Average battery supply
current with system in a
connection state with 30ms
connection interval and
extended sleep with all RAM
retained. TX output power at
2dBm. FLASH is off.
92
μA
I
BAT_FLASH
battery supply current with
CPU fetching code from
serial FLASH. RF is off.
0.24
mA
I
BAT_HIBERN
battery supply current with
system shut down
(Hibernation or shipping
mode). FLASH is off.
0.6
μA
I
BAT_IDLE
battery supply current with
CPU in Wait for Interrupt
Mode. FLASH is off.
0.23
mA
I
BAT_SLP_20KB
battery supply current with
system in extended sleep
mode and 20KB RAM
retained
1.7
μA