Data Sheet

DA14531MOD
SmartBond TINY
TM
Module
Preliminary
Datasheet
Revision 2.1
4-June-2020
CFR0011-120-00
1 of 31
© 2020 Dialog Semiconductor
General Description
The DA14531 TINY
TM
Module, is the first Dialog Bluetooth® Low Energy module based on world’s
lowest power DA14531 SoC.
The module offers a unique combination of lowest power, integration of all external components
including antenna at a very affordable cost.
It is designed to enable use of Bluetooth Low Energy in applications where BLE was prohibitive so
far because of cost or complexity. The bigger picture is to drive Bluetooth Low Energy technology
into every application, turning every product into a connected IoT node driving the next 1 billion IoT
devices in the market.
The SmartBond TINY module is supported by easy to work with software to lower the threshold of
using BLE technology or speeding up design time significantly.
It comes with configurable DSPS (serial port service) and a next generation Codeless software to
design Bluetooth applications without Bluetooth knowledge or advanced programming skills.
The combination of affordable cost, lowest power and ease of use makes it an ideal product for the
mass market, including the makers community.
Key Features
Bluetooth
Compatible with Bluetooth v5.1, ETSI EN
300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US) and
ARIB STD-T66 (Japan) core
Supports up to 3 BLE connections
Processing and memories
16 MHz 32-bit Arm
®
Cortex
®
M0+ with
SWD interface
128 Kbytes internal FLASH
48 Kbytes RAM
144 Kbytes ROM
32 Kbytes OTP
Current Consumption
2 mA RX at VBAT=3V
4 mA TX at VBAT=3V and 0 dBm
1.8 uA at sleep with all RAM retained
Radio
Programmable RF transmit power from
-19 to +2.2 dBm
-93 dBm receiver sensitivity
Interfaces
Quadrature decoder with 3 channels
4 channel 11-bit ENOB ADC
2 general purpose timers with PWM
capabilities
Built in temperature sensor
9 GPIOs
SPI
2x UART, 1wire UART support
I2C
Power Management
Operating range (1.8V - 3.3V)
Inrush current control
Other
Real Time Clock
Packaging
12.5 mm x 14.5 mm x 2.8 mm package
Module Software Development Kit
Configurable DSPS
Codeless v2.0
SDK6 support
Module Software Tools
Flash/OTP programmer
SUOTA support
Battery Life Estimation
Data Rate Monitoring
Real-Time Power Profiling
Production Line Testing
Standards Conformance
CE and FCC
Canada
Japan
South Korea and Taiwan
Australia/New Zealand
South Africa
Brazil
China and Thailand

Summary of content (31 pages)