Datasheet
ICP-10111
Document Number: DS-000177 Page 7 of 31
Revision: 1.3
2.3 PRESSURE SENSOR SPECIFICATIONS
Pressure sensor specifications are given in Table 3. Default conditions of 25 °C and 1.8V supply voltage apply, unless otherwise stated.
PARAMETER
CONDITIONS
TYP
UNITS
NOTES
Absolute Accuracy
Normal range
Extended range
±1
±1.5
hPa
1, 3
Relative Accuracy
Any step ≤ 1 kPa, 25 °C
Any step ≤ 10 kPa, 25 °C
±1
±3
Pa
3
Long-term drift
During 1 year
Normal Range
±35
Pa/y
Extended Range
±40
Pa/y
Solder drift
0.5
hPa
1, 2, 4
Temperature coefficient offset
P = 100 kPa
25°C … 45°C
±0.5
Pa/°C
3
Resolution
Maximum range
0.01
Pa
Table 3. Pressure Sensor Specifications
Notes:
1. Absolute accuracy may be improved through One Point Calibration.
2. Sensor accuracy post Solder reflow may be improved through One Point Calibration.
3. Parameter specifications shown are component-level. They may be different at the board-level and may depend on PCB characteristics
including but not limited to PCB material, number of layers, PCB thickness. They may also depend on usage conditions.
4. Specification value is based on PCBs with no solder mask under the device. Specification value may depend on PCB characteristics
including but not limited to PCB material, number of layers, PCB thickness. It may also depend on usage conditions.
2.4 TEMPERATURE SENSOR SPECIFICATIONS
Specifications of the temperature sensor are shown in Table 4.
PARAMETER
CONDITIONS
TYP
UNITS
Absolute Accuracy
Extended range
±0.4
°C
Repeatability
Extended range
±0.1
°C
Resolution
Maximum range
0.01
°C
Long-term drift
Normal range
<0.04
°C/y
Table 4. Temperature Sensor Specifications
2.5 RECOMMENDED OPERATION CONDITIONS
The pressure sensor exhibits best performance when operated within the normal pressure and temperature range 0°C < T < 45°C
and 95 kPa < P < 105 kPa.
Injected photo current due to strong light sources can influence the sensor performance and should be avoided to guarantee best
operation.
The sensor should not be exposed to high mechanical stress, the resulting deformation of the package can alter internal dimensions
and therefore falsify the sensor signal. Solder reflow may affect device performance. One-point calibration can improve the sensor
accuracy post solder reflow.