Datasheet

ICP-10111
Document Number: DS-000177 Page 22 of 31
Revision: 1.3
6 ASSEMBLY
This section provides general guidelines for assembling TDK-InvenSense Micro Electro-Mechanical Systems (MEMS) pressure sensors.
6.1 IMPLEMENTATION AND USAGE RECOMMENDATIONS
Soldering
When soldering, use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures of 260°C. ICP-10111 may exhibit a
pressure offset after soldering, some settling time may be required depending on soldering properties, PCB properties, and ambient
conditions.
The ICP-10111 is an open cavity package, it is mandatory to use no-clean solder paste and no board wash should be applied.
Chemical Exposure and Sensor Protection
The ICP-10111 is an open cavity package, and should not be exposed to particulates or liquids. If any type of protective coating must
be applied to the circuit board, the sensor must be protected during the coating process.