Datasheet

ManualsBrandsDFRobot ManualsElectronic Experimentation PartsGravity ICP-10111 Pressure Sensor

ICP-10111

High Accuracy, Low Power, Barometric Pressure

and Temperature Sensor IC

InvenSense reserves the right to change the detail

specifications as may be required to permit

improvements in the design of its products.

InvenSense, a TDK Group Company

1745 Technology Drive, San Jose, CA 95110 U.S.A

+1(408) 988–7339

invensense.tdk.com

Document Number: DS-000177

Revision: 1.3

Release Date: 05/03/2021

GENERAL INFORMATION

The ICP-10111 pressure sensor family is based on MEMS

capacitive technology which provides ultra-low noise at the

lowest power, enabling industry leading relative accuracy,

sensor throughput, and temperature stability. The pressure

sensor can measure pressure differences with an accuracy of

±1 Pa, enabling altitude measurement differentials as small as

8.5 cm, less than the height of a single stair step.

Consuming only 1.3 µA @1 Hz, available in footprint of 2 mm

x 2.5 mm x 0.92 mm, the ICP-10111 is ideally suited for

mobile phones, wearable fitness monitoring, drones, and

battery powered IoT.

The ICP-10111 offers an industry leading temperature

coefficient offset of ±0.5 Pa/C. The combination of high

accuracy, low power, temperature stability, waterproofing in

a small footprint enables higher performance barometric

pressure sensing for sports activity identification, mobile

indoor/outdoor navigation, and altitude-hold in drones.

DEVICE INFORMATION

PART

NUMBER

PACKAGE

LID OPENING

MSL**

ICP-10111*

2x2.5x0.92mm

LGA-8L

1-Hole

* Denotes RoHS and Green-Compliant Package

** Moisture Sensitivity Level of the package

APPLICATIONS

• Altitude Control of Drones and Flying Toys

• Mobile Phones

• Virtual Reality and Gaming Equipment

• Indoor/Outdoor Navigation (dead-reckoning,

floor/elevator/step detection)

• Vertical velocity monitoring

• Leisure, Sports, and Fitness Activity Identification

• Weather Forecasting

FEATURES

• Pressure operating range: 30 to 110 kPa

• Noise and current consumption

o 0.4 Pa @ 10.4 µA (ULN mode)

o 0.8 Pa @ 5.2 µA (LN mode)

o 3.2 Pa @ 1.3 µA (LP mode)

• Pressure Sensor Relative Accuracy: ±1 Pa for any

10 hPa change over 950 hPa-1050 hPa at 25C

• Pressure Sensor Absolute Accuracy: ±1 hPa over

950 hPa-1050 hPa, 0C to 65C

• Pressure Sensor Temperature Coefficient Offset:

±0.5 Pa/C over 25C to 45C at 100 kPa

• Temperature Sensor Absolute Accuracy: ±0.4C

• Temperature operating range: -40 °C to 85 °C

• Host Interface: I

C at up to 400 kHz

• Single Supply voltage: 1.8V ±5%

• RoHS and Green compliant

1-Hole Lid Opening

ICP-10111

BLOCK DIAGRAM

VDD

GND

VDD

100nf

GND

SCL

SDA

VDD

ICP-10111

MCU/HUB/AP

I2C

Summary of content (31 pages)

PAGE 1
ICP-10111 High Accuracy, Low Power, Barometric Pressure and Temperature Sensor IC GENERAL INFORMATION FEATURES • • The ICP-10111 pressure sensor family is based on MEMS capacitive technology which provides ultra-low noise at the lowest power, enabling industry leading relative accuracy, sensor throughput, and temperature stability. The pressure sensor can measure pressure differences with an accuracy of ±1 Pa, enabling altitude measurement differentials as small as 8.
PAGE 2
ICP-10111 TABLE OF CONTENTS GENERAL INFORMATION............................................................................................................................................................................... 1 DEVICE INFORMATION ................................................................................................................................................................................. 1 APPLICATIONS ...........................................................................
PAGE 3
ICP-10111 8 PART NUMBER PART MARKINGS ............................................................................................................................................. 26 9 TAPE & REEL SPECIFICATION .................................................................................................................................................... 27 10 ORDERING GUIDE...............................................................................................................................
PAGE 4
ICP-10111 LIST OF FIGURES Figure 1. Digital I/O Pads Timing .......................................................................................................................................... 10 Figure 2. Pin Out Diagram for ICP-10111 2 mm x 2.5 mm x 0.92 mm LGA ......................................................................... 11 Figure 3. ICP-10111 Application Schematic .........................................................................................................................
PAGE 5
ICP-10111 1 INTRODUCTION 1.1 PURPOSE AND SCOPE This document is a preliminary product specification, providing a description, specifications, and design related information for the ICP-10111 Pressure Sensor. Specifications are subject to change without notice. Final specifications will be updated based upon characterization of production silicon. 1.2 PRODUCT OVERVIEW The ICP-10111 is an ultra-low power, low noise, digital output barometric pressure and temperature sensor IC.
PAGE 6
ICP-10111 2 PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS 2.1 OPERATION RANGES The sensor shows best performance when operated within the recommended temperature and pressure range (hereafter called normal conditions) of 0°C – 45°C and 95 kPa – 105 kPa, respectively. The following ranges are defined for the device: OPERATION RANGE PRESSURE (KPA) TEMPERATURE (C) Normal 95 to 105 0 to 45 Extended 30 to 110 -20 to 65 Maximum 25 to 115 -40 to 85 Table 1. Operation Ranges 2.
PAGE 7
ICP-10111 2.3 PRESSURE SENSOR SPECIFICATIONS Pressure sensor specifications are given in Table 3. Default conditions of 25 °C and 1.8V supply voltage apply, unless otherwise stated. PARAMETER Absolute Accuracy Relative Accuracy CONDITIONS Normal range Extended range Any step ≤ 1 kPa, 25 °C Any step ≤ 10 kPa, 25 °C TYP ±1 ±1.5 ±1 ±3 UNITS NOTES hPa 1, 3 Pa 3 Normal Range Extended Range ±35 ±40 0.5 Pa/y Pa/y hPa 1, 2, 4 ±0.5 Pa/°C 3 0.
PAGE 8
ICP-10111 3 ELECTRICAL SPECIFICATIONS 3.1 ELECTRICAL CHARACTERISTICS Default conditions of 25 °C and 1.8V supply voltage apply to values in Table 5, unless otherwise stated. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 1.71 1.8 1.89 V 1.25 1.5 V 100 ms COMMENTS Supply voltage VDD Power-up/down level VPOR Static power supply 1.0 Supply Ramp Time TRAMP Monotonic ramp. Ramp rate is 10% to 90% of the final value 0.01 Idle state - 1.0 2.
PAGE 9
ICP-10111 3.2 ABSOLUTE MAXIMUM RATINGS Stress levels beyond those listed in Table 6 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions cannot be guaranteed. Exposure to the absolute maximum rating conditions for extended periods may affect the reliability of the device. PARAMETER RATING Supply voltage, VDD -0.3V to 2.16V Supply Voltage, SCL & SDA -0.3V to VDD 0.
PAGE 10
ICP-10111 3.4 I2C TIMING CHARACTERIZATION Default conditions of 25°C and 1.8V supply voltage apply to values in Table 8, unless otherwise stated. PARAMETER SYMBOL SCL clock frequency CONDITIONS fSCL Hold time (repeated) START condition After this period, the first clock pulse is generated tHD;STA MIN TYP MAX UNITS 0 - 400 kHz 0.6 - - µs LOW period of the SCL clock tLOW 1.3 - - µs HIGH period of the SCL clock tHIGH 0.
PAGE 11
ICP-10111 4 APPLICATIONS INFORMATION 4.1 INTERFACE SPECIFICATIONS The ICP-10111 supports I2C fast mode, SCL clock frequency from 0 to 400 kHz. 4.2 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION ICP-10111: 2x2.5x0.
PAGE 12
ICP-10111 4.3 TYPICAL OPERATING CIRCUIT VDD 1.71-1.89V 8 1 VDD GND GND C1, 100nF GND GND No Internal Connection Can connect to: VDD/VDDIO/GND/NC GND No Internal Connection 7 2 GND RESV Can connect to: VDD/VDDIO/GND/NC 3 SDA 6 TOP VIEW RESV SDA 5 4 RESV SCL SCL Figure 3. ICP-10111 Application Schematic Power supply pins supply voltage (Vdd) and ground (Vss) must be decoupled with a 100 nF capacitor that shall be placed as close to the sensor as possible (see Figure 4).
PAGE 13
ICP-10111 User should refer to AN-000140 “TDK-InvenSense Pressure Sensor PCB Design Guidelines” for PCB guidelines and sensor integration. 4.4 BILL OF MATERIALS FOR EXTERNAL COMPONENTS COMPONENT VDD Bypass Capacitor LABEL SPECIFICATION QUANTITY C1 Ceramic, X7R, 100 nF ±10% 1 Table 10. Bill of Materials Document Number: DS-000177 Revision: 1.
PAGE 14
ICP-10111 5 OPERATION AND COMMUNICATION All commands and memory locations of the ICP-10111 are mapped to a 16-bit address space which can be accessed via the I2C protocol. ICP-10111 BINARY DECIMAL HEXADECIMAL I2C address 110’0011 99 0x63 Table 11. ICP-10111 I2C Device Address 5.1 POWER-UP AND COMMUNICATION START Upon VDD reaching the power-up voltage level VPOR, the ICP-10111 enters idle state after a duration of tPU.
PAGE 15
ICP-10111 Two bytes of data are always followed by one byte CRC checksum, for calculation see section 5.8. Each byte must be acknowledged by the microcontroller with an ACK condition for the sensor to continue sending data. If the ICP-10111 does not receive an ACK from the master after any byte of data, it will not continue sending data. Whether the sensor sends out pressure or temperature data first depends on the measurement command that was sent to the sensor to initiate the measurement (see Table 12).
PAGE 16
ICP-10111 PROPERTY VALUE Name CRC-8 Width 8 bits Polynomial 0x31 (x8 + x5 + x4 + 1) Initialization 0xFF Reflect input false Reflect output false Final XOR 0x00 Examples CRC(0x00) = 0xAC CRC(0xBEEF) = 0x92 Table 16. ICP-10111 I2C CRC Properties 5.9 CONVERSION OF SIGNAL OUTPUT Pressure measurement data is always transferred as 4 8-bit words; temperature measurement data is always transferred as two 8bit words. Please see section 5.5 for more details.
PAGE 17
ICP-10111 5.10 READ-OUT OF CALIBRATION PARAMETERS For converting raw pressure data to physical values, four calibration parameters have to be retrieved from the OTP of the sensor. Set up of OTP read: 1) Send I2C write header 0xC6 2) Send command 0xC595 (move pointer in address register) 3) Send address parameter together with its CRC 0x00669C Steps 1) – 3) can be executed on many platforms by a single I2C write of the value 0xC59500669C.
PAGE 18
ICP-10111 status = inv_invpres_serif_write_reg(&s->serif, ICC_ADDR_PRS, data_write, 5); if (status) return status; // Read OTP values for (i = 0; i < 4; i++) { data_write[0] = 0xC7; data_write[1] = 0xF7; status = inv_invpres_serif_write_reg(&s->serif, ICC_ADDR_PRS, data_write, 2); if (status) return status; status = inv_invpres_serif_read_reg(&s->serif, ICC_ADDR_PRS, data_read, 3); if (status) return status; out[i] = data_read[0]<<8 | data_read[1]; } return 0; } void init_base(struct inv_invpres * s, short
PAGE 19
ICP-10111 (p_LUT[2] * (p_Pa[0] - p_Pa[1]) + p_LUT[0] * (p_Pa[1] - p_Pa[2]) + p_LUT[1] * (p_Pa[2] - p_Pa[0])); A = (p_Pa[0] * p_LUT[0] - p_Pa[1] * p_LUT[1] - (p_Pa[1] - p_Pa[0]) * C) / (p_LUT[0] - p_LUT[1]); B = (p_Pa[0] - A) * (p_LUT[0] + C); out[0] = A; out[1] = B; out[2] = C; } 5.
PAGE 20
ICP-10111 """ Convert an output from a calibrated sensor to a pressure in Pa. Arguments: p_LSB -- Raw pressure data from sensor T_LSB -- Raw temperature data from sensor """ t = T_LSB - 32768.0 s1 = self.LUT_lower + float(self.sensor_constants[0] * t * t) * self.quadr_factor s2 = self.offst_factor * self.sensor_constants[3] + float(self.sensor_constants[1] * t * t) * self.quadr_factor s3 = self.LUT_upper + float(self.sensor_constants[2] * t * t) * self.quadr_factor A, B, C = self.
PAGE 21
ICP-10111 repeated I2C address + read while meas. is in prog.
PAGE 22
ICP-10111 6 ASSEMBLY This section provides general guidelines for assembling TDK-InvenSense Micro Electro-Mechanical Systems (MEMS) pressure sensors. 6.1 IMPLEMENTATION AND USAGE RECOMMENDATIONS Soldering When soldering, use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures of 260°C. ICP-10111 may exhibit a pressure offset after soldering, some settling time may be required depending on soldering properties, PCB properties, and ambient conditions.
PAGE 23
ICP-10111 7 PACKAGE DIMENSIONS Package dimensions for the ICP-10110 & ICP-10111: Top View: ICP-10111 Bottom View: ICP-10111 Figure 6. ICP-10111 Package Diagrams Document Number: DS-000177 Revision: 1.
PAGE 24
ICP-10111 SYMBOLS MIN. 0.84 ------1.90 --2.40 ----0.35 0.05 0.30 --- A A3 b c E E1 D D1 e L L1 L3 S DIMENSIONS IN MILLIMETERS NOM. 0.92 0.79 REF. 0.35 0.13 REF. 2.00 1.85 2.50 2.35 0.65 0.45 0.10 0.35 0.10 Table 17. ICP-10111 Package Dimensions Recommended PCB land pattern for the ICP-10111: Figure 7. ICP-10111 recommended PCB land pattern Document Number: DS-000177 Revision: 1.3 Page 24 of 31 MAX. 1.00 ------2.10 --2.60 ----0.55 0.15 0.
PAGE 25
ICP-10111 Product artwork for the ICP-10111: Package Artwork: ICP-10111 Document Number: DS-000177 Revision: 1.
PAGE 26
ICP-10111 8 PART NUMBER PART MARKINGS The part number part markings for ICP-10111 devices are summarized below: PART NUMBER ICP-10111 PART MARKING P6 Table 18. Part Number Part Markings TOP VIEW 1-Hole (ICP-10111) P6 XXXX YW Part Number Lot Traceability Code Date Code: (Y)Year(W)WorkWeek Figure 8. Part Number Part Markings for 2x2.5mm (ICP-10111) Document Number: DS-000177 Revision: 1.
PAGE 27
ICP-10111 9 TAPE & REEL SPECIFICATION Figure 9. ICP-10111 Tape Dimensions Figure 10. ICP-10111 Tape and Reel Drawing Document Number: DS-000177 Revision: 1.
PAGE 28
ICP-10111 10 ORDERING GUIDE PART TEMP RANGE PACKAGE BODY PACKAGE LID QUANTITY PACKAGING ICP-10111† −40°C to +85°C 2x2.5x0.92mm LGA-8L 1-Hole 10,000 13” Tape and Reel †Denotes RoHS and Green-Compliant Package Document Number: DS-000177 Revision: 1.
PAGE 29
ICP-10111 11 REFERENCES Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information: • Manufacturing Recommendations o Assembly Guidelines and Recommendations o PCB Design Guidelines and Recommendations o MEMS Handling Instructions o ESD Considerations o Reflow Specification o Storage Specifications o Package Marking Specification o Reel & Pizza Box Label o Packaging o Representative Shipping Carton Label • Compliance o Environmental Compliance o DRC Complianc
PAGE 30
ICP-10111 12 REVISION HISTORY Revision Date Revision Description 01/11/2017 0.1 Initial Release 01/17/2017 0.2 Updated Sections 6, 7 10/02/2020 1.0 Updated all sections 10/07/2020 1.1 Updated document title 04/06/2021 1.2 Updated Long-Term Drift specification (Table 3). 05/03/2021 1.3 Added MSL information (Cover Page); Added Tape & Reel Specification (Section 9). Document Number: DS-000177 Revision: 1.
PAGE 31
ICP-10111 This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice.