Fermion TMF8801 ToF Distance Ranging Sensor (20-2500mm) - Datasheet
Table Of Contents
- Content Guide
- 1 General Description
- 2 Ordering Information
- 3 TMF8801 Module Description
- 4 Absolute Maximum Ratings
- 5 Electrical Characteristics
- 6 Typical Operating Characteristics
- 7 Functional Description
- 8 Register Description
- 8.1 APPID Register (Address 0x00)
- 8.2 APPREV_MAJOR Register (Address 0x01)
- 8.3 APPREQID Register (Address 0x02)
- 8.4 ENABLE Register (Address 0xE0)
- 8.5 INT_STATUS Register (Address 0xE1)
- 8.6 INT_ENAB Register (Address 0xE2)
- 8.7 ID Register (Address 0xE3)
- 8.8 REVID Register (Address 0xE4)
- 8.9 App0 Registers – appid=0xC0
- 8.9.1 CMD_DATA9 Register (Address 0x06)
- 8.9.2 CMD_DATA8 Register (Address 0x07)
- 8.9.3 CMD_DATA7 Register (Address 0x08)
- 8.9.4 CMD_DATA6 Register (Address 0x09)
- 8.9.5 CMD_DATA5 Register (Address 0x0A)
- 8.9.6 CMD_DATA4 Register (Address 0x0B)
- 8.9.7 CMD_DATA3 Register (Address 0x0C)
- 8.9.8 CMD_DATA2 Register (Address 0x0D)
- 8.9.9 CMD_DATA1 Register (Address 0x0E)
- 8.9.10 CMD_DATA0 Register (Address 0x0F)
- 8.9.11 COMMAND Register (Address 0x10)
- 8.9.12 PREVIOUS Register (Address 0x11)
- 8.9.13 APPREV_MINOR Register (Address 0x12)
- 8.9.14 APPREV_PATCH Register (Address 0x13)
- 8.9.15 STATUS Register (Address 0x1D)
- 8.9.16 REGISTER_CONTENTS Register (Address 0x1E)
- 8.9.17 TID Register (Address 0x1F)
- 8.9.18 Object Detection Results – If Register register_contents = 0x55 (commands 0x02, 0x03 or 0x04)
- RESULT_NUMBER Register (Address 0x20)
- RESULT_INFO Register (Address 0x21)
- DISTANCE_PEAK_0 Register (Address 0x22)
- DISTANCE_PEAK_1 Register (Address 0x23)
- SYS_CLOCK_0 Register (Address 0x24)
- SYS_CLOCK_1 Register (Address 0x25)
- SYS_CLOCK_2 Register (Address 0x26)
- SYS_CLOCK_3 Register (Address 0x27)
- STATE_DATA_0 Register (Address 0x28)
- STATE_DATA_1 Register (Address 0x29)
- STATE_DATA_2 Register (Address 0x2A)
- STATE_DATA_3 Register (Address 0x2B)
- STATE_DATA_4 Register (Address 0x2C)
- STATE_DATA_5 Register (Address 0x2D)
- STATE_DATA_6 Register (Address 0x2E)
- STATE_DATA_7 Register (Address 0x2F)
- STATE_DATA_8_XTALK_MSB Register (Address 0x30)
- STATE_DATA_9_XTALK_LSB Register (Address 0x31)
- STATE_DATA_10_TJ Register (Address 0x32)
- REFERENCE_HITS_0 Register (Address 0x33)
- REFERENCE_HITS_1 Register (Address 0x34)
- REFERENCE_HITS_2 Register (Address 0x35)
- REFERENCE_HITS_3 Register (Address 0x36)
- OBJECT_HITS_0 Register (Address 0x37)
- OBJECT_HITS_1 Register (Address 0x38)
- OBJECT_HITS_2 Register (Address 0x39)
- OBJECT_HITS_3 Register (Address 0x3A)
- 8.9.19 Calibration and Algorithm State Data Exchange
- FACTORY_CALIB_0 Register (Address 0x20)
- FACTORY_CALIB_1 Register (Address 0x21)
- FACTORY_CALIB_2 Register (Address 0x22)
- FACTORY_CALIB_3 Register (Address 0x23)
- FACTORY_CALIB_4 Register (Address 0x24)
- FACTORY_CALIB_5 Register (Address 0x25)
- FACTORY_CALIB_6 Register (Address 0x26)
- FACTORY_CALIB_7 Register (Address 0x27)
- FACTORY_CALIB_8 Register (Address 0x28)
- FACTORY_CALIB_9 Register (Address 0x29)
- FACTORY_CALIB_10 Register (Address 0x2A)
- FACTORY_CALIB_11 Register (Address 0x2B)
- FACTORY_CALIB_12 Register (Address 0x2C)
- FACTORY_CALIB_13 Register (Address 0x2D)
- STATE_DATA_WR_0 Register (Address 0x2E)
- STATE_DATA_WR_1 Register (Address 0x2F)
- STATE_DATA_WR_2 Register (Address 0x30)
- STATE_DATA_WR_3 Register (Address 0x31)
- STATE_DATA_WR_4 Register (Address 0x32)
- STATE_DATA_WR_5 Register (Address 0x33)
- STATE_DATA_WR_6 Register (Address 0x34)
- STATE_DATA_WR_7 Register (Address 0x35)
- STATE_DATA_WR_8 Register (Address 0x36)
- STATE_DATA_WR_9 Register (Address 0x37)
- STATE_DATA_WR_10 Register (Address 0x38)
- 8.9.20 Raw Histogram Output – If Register register_contents=0x80…0x93
- 8.9.21 Serial Number Readout – If Register register_contents=0x47
- 8.10 Bootloader Registers – appid=0x80
- 9 Application Information
- 10 Package Drawings & Markings
- 11 Tape & Reel Information
- 12 Soldering & Storage Information
- 13 Laser Eye Safety
- 14 Revision Information
- 15 Legal Information
Document Feedback
TMF8801
Soldering & Storage Information
Datasheet • PUBLIC
DS000648 • v8-00 • 2021-Jul-08
69 │ 65
Parameter
Reference
Device
Time above 230 °C (T2)
t
2
Max 50 s
Time above T
peak
– 10 °C (T3)
t
3
Max 10 s
Peak temperature in reflow
T
peak
260 °C
Temperature gradient in cooling
Max −5 °C/s
12.2 Storage Information
12.2.1 Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the
release and vaporization of moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of absorbed moisture possible, each device is
baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope
called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping,
handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date
code on the bag when stored under the following conditions:
● Shelf Life: 12 months
● Ambient Temperature: <40 °C
● Relative Humidity: <90 %
Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity
Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture
region.
Floor Life
The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of
devices removed from the moisture barrier bag is 168 hours from the time the bag was opened,
provided that the devices are stored under the following conditions:
● Floor Life: 168 hours
● Ambient Temperature: <30 °C
● Relative Humidity: <60 %
If the floor life or the temperature/humidity conditions have been exceeded, the devices must be
rebaked prior to solder reflow or dry packing.