Fermion TMF8801 ToF Distance Ranging Sensor (20-2500mm) - Datasheet

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TMF8801
Content Guide
Datasheet PUBLIC
DS000648 v8-00 2021-Jul-08
Content Guide
1 General Description ...................... 3
1.1 Key Benefits & Features ............................... 3
1.2 Applications .................................................. 4
1.3 Block Diagram .............................................. 4
2 Ordering Information .................... 5
3 TMF8801 Module Description ....... 6
3.1 Pin Diagram .................................................. 6
3.2 Pin Description ............................................. 6
4 Absolute Maximum Ratings ......... 8
5 Electrical Characteristics ............. 9
5.1 Recommended Operating Conditions .......... 9
6 Typical Operating
Characteristics .............................10
7 Functional Description ................13
7.1 I²C Protocol................................................. 13
7.2 System Parameters .................................... 13
7.3 I/O ............................................................... 14
7.4 Power Consumption ................................... 15
7.5 Timing ......................................................... 16
7.6 Algorithm Performance ............................... 17
7.7 VCSEL ........................................................ 19
7.8 Typical Optical Characteristics ................... 19
8 Register Description ....................21
8.1 APPID Register (Address 0x00) ................. 21
8.2 APPREV_MAJOR Register (Address
0x01) ........................................................... 21
8.3 APPREQID Register (Address 0x02) ......... 21
8.4 ENABLE Register (Address 0xE0) ............. 22
8.5 INT_STATUS Register (Address 0xE1) ..... 22
8.6 INT_ENAB Register (Address 0xE2) .......... 23
8.7 ID Register (Address 0xE3) ........................ 23
8.8 REVID Register (Address 0xE4) ................ 24
8.9 App0 Registers appid=0xC0 .................... 24
8.10 Bootloader Registers appid=0x80 ........... 52
9 Application Information ............... 56
9.1 SPAD Options ............................................ 56
9.2 Reference SPAD, TDC and Histogram ...... 57
9.3 Schematic ................................................... 58
9.4 PCB Layout ................................................ 60
9.5 PCB Pad Layout ......................................... 61
10 Package Drawings & Markings ... 62
11 Tape & Reel Information .............. 63
12 Soldering & Storage Information 64
12.1 Soldering Information ................................. 64
12.2 Storage Information .................................... 65
13 Laser Eye Safety .......................... 67
14 Revision Information ................... 68
15 Legal Information ......................... 69