Datasheet
Table Of Contents
- General Description
- Pin Assignments
- Absolute Maximum Ratings
- Electrical Characteristics
- Typical Operating Characteristics
- Detailed Description
- Register Description
- Application Information
- Package Information
- Tape & Reel Information
- Soldering & Storage Information
- Laser Eye Safety
- Ordering & Contact Information
- RoHS Compliant & ams Green Statement
- Copyrights & Disclaimer
- Document Status
- Revision Information
- Content Guide
ams Datasheet Page 57
[v1-08] 2020-Jun-29 Document Feedback
TMF8701 − Soldering & Storage Information
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: <30°C
• Relative Humidity: <60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.