Datasheet

Page 56 ams Datasheet
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TMF8701 − Soldering & Storage Information
Figure 122:
Solder Reflow Profile
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping. Devices are dry packed in a sealed
aluminized envelope called a moisture-barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: <40°C
• Relative Humidity: <90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Parameter Reference Device
Average temperature gradient in preheating 2.5°C/s
Soak time
t
soak
2 to 3 minutes
Time above 217 °C (T1) t1 Max 60s
Time above 230 °C (T2) t2 Max 50s
Time above Tpeak – 10 °C (T3) t3 Max 10s
Peak temperature in reflow
T
peak
260°C
Temperature gradient in cooling Max −5°C/s