Datasheet
Table Of Contents
- General Description
- Pin Assignments
- Absolute Maximum Ratings
- Electrical Characteristics
- Typical Operating Characteristics
- Detailed Description
- Register Description
- Application Information
- Package Information
- Tape & Reel Information
- Soldering & Storage Information
- Laser Eye Safety
- Ordering & Contact Information
- RoHS Compliant & ams Green Statement
- Copyrights & Disclaimer
- Document Status
- Revision Information
- Content Guide
ams Datasheet Page 55
[v1-08] 2020-Jun-29 Document Feedback
TMF8701 − Soldering & Storage Information
Soldering Information
The package has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The process,
equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 121:
Solder Reflow Profile Graph
Soldering & Storage
Information