Datasheet
Table Of Contents
- General Description
- Pin Assignments
- Absolute Maximum Ratings
- Electrical Characteristics
- Typical Operating Characteristics
- Detailed Description
- Register Description
- Application Information
- Package Information
- Tape & Reel Information
- Soldering & Storage Information
- Laser Eye Safety
- Ordering & Contact Information
- RoHS Compliant & ams Green Statement
- Copyrights & Disclaimer
- Document Status
- Revision Information
- Content Guide
Page 12 ams Datasheet
Document Feedback [v1-08] 2020-Jun-29
TMF8701 − Detailed Description
Power Consumption
All current consumption values include silicon process
variation. Temperature and voltages are at nominal conditions
(23ºC and 2.8V).
Figure 13:
Power Consumption
Condition Min Typ Max Units Comment
I_VDD Power down
Enable Pin Low
I²C Off
0.02 0.26 1 μAState: Power down
I_VDD Standby
CPU Off, RAM On
OSC Off, pon=0
I²C Wakeup Only
85 μAState: Standby
I_VDD Wait
CPU Off, RAM On,
OSC On 5MHz
I²C On, Timer Wakeup
140 μAState: Wait
I_VDD Ranging Processing
CPU Running at 80MHz
No VCSEL, No TDC
2.7 mA
State: Histogram
processing
I_VDD Ranging Active
CPU stopped
VCSEL 43MHz 320ps pulses,
TDCs running
32.5 mA State: Ranging active
I_VDD Background
measurement Active CPU
stopped
VCSEL off, TDCs running
13 mA
I_VDD
Ranging
60Hz, 16.6ms, distance and
proximity algorithm
combined
26 mA
Average power
consumption
Peak VCSEL Current 320ps
pulses
230 mA
Max VCSEL Duty Cycle 2 %