TMF8701 Time-of-Flight Sensor General Description The TMF8701 is a time-of-flight (TOF) sensor in a single modular package with associated VCSEL. The TOF device is based on SPAD, TDC and histogram technology. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of TMF8701, Time-of-Flight Sensor are listed below: Figure 1: Added Value of Using TMF8701 Benefits Feature • Modular package - 2.2mm x 3.6mm x 1.
TMF8701 − General Description Applications The device is ideal for use in the mobile phone market with applications including: • Distance measurement for camera autofocus (Laser Detect Autofocus - LDAF) • Supporting low-power system operation by enabling high-power components (i.e.
TMF8701 − Pin Assignments Pin Assignments Pin Diagram Figure 3: Pin Diagram TMF8701 Module Pin Diagram TMF8701 Module: Top through view (not to scale) VDDC 1 12 VDDV GNDC 2 11 GNDV GPIO0 3 10 GPIO1 INT 4 9 EN SCL 5 8 GND SDA 6 7 VDD Pin Description The GPIO is controlled by the firmware. Figure 4: Pin Description TMF8701 Module Pin No. Pin Name Signal Type Description 1 VDDC Supply Charge pump supply voltage (3V); add a capacitor GRM155R70J104KA01 (0402 X7R 0.1μF 6.
TMF8701 − Pin Assignments Pin No. Pin Name Signal Type Description 6 SDA I/O 7 VDD Supply Chip supply voltage (3V); add a capacitor GRM155R70J104KA01 (0402 X7R 0.1μF 6.
TMF8701 − Absolute Maximum Ratings Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Electrical Specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
TMF8701 − Absolute Maximum Ratings Symbol Parameter Min Max Units Comment Temperature Ranges and Storage Conditions TSTRG Storage Temperature RHNC TBODY MSL 85 ºC Relative Humidity (non-condensing) 85 % Package Body Temperature 260 ºC Moisture Sensitivity Level -40 3 IPC/JEDEC J-STD-020(1) Represents a maximum floor life time of 168h with TAMB<30ºC and <60% r.h. Note(s): 1.
TMF8701 − Electrical Characteristics Electrical Characteristics Recommended Operating Conditions Device parameters are guaranteed at nominal conditions otherwise noted. While the device is operational across the temperature range, functionality will vary with temperature. Figure 6: Recommended Operating Conditions TMF8701 Module Parameter Min Typ Max Units VDDV, VDDC, VDD 3V Supply voltage 2.7 3 3.
TMF8701 − Typical Operating Characteristics Following operating characteristics are measured with calibrated devices with a full optical stack including glass and IR ink with >90% transmissivity. The airgap is set to 0.38mm. The ambient light is measured on the target. As target object a grey card with 20cm x 26cm is used. Typical Operating Characteristics Figure 7: 350Lux Fluorescent Light 350Lux Fluorescent Light, Measured Distance vs.
TMF8701 − Typical Operating Characteristics Figure 9: 14kLux Halogen Light (100kLux Sunlight Equivalent) 14kLux HalogĞn Light (100kLux sunlight equivalent), Measured Distance vs. Target Distance [mm] 400 350 300 250 200 150 100 50 0 0 50 100 150 200 250 300 350 400 Figure 10: Field of Illumination of VCSEL (FOI), x-axis: ±10.4°, y-axis: ±10.
TMF8701 − Detailed Description Detailed Description I²C Protocol The TMF8701 is controlled by an I²C bus, one interrupt pin and two GPIO pins. The device uses I²C serial communication protocol for communication. The device supports 7-bit chip addressing and standard, fast mode and fast mode plus modes. Read and Write transactions comply with the standard set by Philips (now NXP). For a complete description of the I²C protocol, please review the NXP I²C design specification.
TMF8701 − Detailed Description TOF Description System Parameters The on-chip microprocessor is a Cortex M0 μP. Figure 11: ARM M0 Parameters Min Typ Max Units Comment 5.37 86 MHz The CPU can operate with the rc oscillator directly or with a 16x PLL RAM 32 kB ROM 32 kB μP Operating Frequency Max PLL Frequency 172 MHz Standard I²C Timing for 1MHz Fast Mode Plus with lower drive. The default TOF address is 0x41. The address can be changed after power-up.
TMF8701 − Detailed Description Power Consumption All current consumption values include silicon process variation. Temperature and voltages are at nominal conditions (23ºC and 2.8V). Figure 13: Power Consumption I_VDD Power down Condition Min Typ Max Units Comment Enable Pin Low I²C Off 0.02 0.
TMF8701 − Detailed Description Timing Ranging Acquisition Timing Figure 14: Ranging Acquisition Timing Min Ranging time proximity and distance mode combined Ranging init (including electrical calibration) Ranging period Typ Max Units Comment 16.
TMF8701 − Detailed Description Reset Pin and Power-Up Timing Figure 16: Reset Pin and Power-Up Timing Min Typ Max Units Comment Does not include RAM download time Power On (boot time) 3 ms Enable High to Ready for Measurement 8 ms Standby to Active Time <<1 ms Active to Standby Time <<1 ms Enable Low to Power Down Time <<1 ms Distance and Proximity Algorithm As the performance of the algorithm is dependent on the ROM version, following section only applies for devices with order code T
TMF8701 − Detailed Description The operating modes have different timings as shown in following table: Figure 17: Algorithm Timings Condition Min Nom Max Units Proximity Mode only command=0x02 or 0x03 cmd_data6=0x81 5.3 ms Proximity and Distance Mode Combined command=0x02 or 0x03 cmd_data6=0xA3 16.6 ms Proximity Mode The proximity algorithm reports a distance information in steps of 1mm and the detect/release threshold can be tuned inside the host.
TMF8701 − Detailed Description Proximity and Distance Mode Combined In the combined operating mode, proximity algorithm is run first followed by distance algorithm. An object detected in proximity mode has priority over an object detected in distance mode. The distance algorithm reports a distance information of the closest object in 1mm steps.
TMF8701 − Detailed Description Typical Optical Characteristics VCSEL Field of Illumination (FOI): 21º Full width from 5% of maximum up to maximum : 19º 1/e 2 TOF Sensor Field of View (FOV): 37º FWHM – in proximity mode : 24º FWHM – in distance mode This Rx SPAD FoV angular response simulates the TMF8701 operation in proximity mode based on the entire SPAD array. The Rx SPAD FoV angular response is reduced when the TMF8701 operates in distance mode since the SPAD array is reduced.
TMF8701 − Register Description Register Description Register Overview Figure 21: APPID Register 0x00: APPID Field Name Reset Type 7:0 appid 0 RW Description Currently running application: 0xC0…. App0 - Measurement application running 0x80….
TMF8701 − Register Description Figure 24: ENABLE Register 0xe0: ENABLE Field Name Reset Type Description 7 cpu_reset 0 RW_SC Write a '1' here to reset CPU. This generates global reset, fully resetting CPU and all CPU registers. The bit resets itself, no need to explicitly clear it. CPU is ready to handle I²C - if this bit is zero, then only the registers 0xe0 and above are usable, the memory mapped I²C space is not used.
TMF8701 − Register Description Figure 26: INT_ENAB Register 0xe2: INT_ENAB Field 1 Name Reset int2_enab 0 int1_enab Type Description RW Raw histogram available interrupt for App0; asserted when a raw histogram can be retrieved from I²C.
TMF8701 − Register Description App0 Registers – appid=0xC0 Following registers are only available if appid=0xC0 (App0): Figure 29: CMD_DATA9 Register 0x06: CMD_DATA9 Field Name Reset Type Description 7:0 cmd_data9 0 W Command data 9 – see register command for future extension of commands Figure 30: CMD_DATA8 Register 0x07: CMD_DATA8 Field Name Reset Type Description 7:0 cmd_data8 0 W Command data 8 – see register command for future extension of commands Figure 31: CMD_DATA7 Register
TMF8701 − Register Description Figure 34: CMD_DATA4 Register 0x0b: CMD_DATA4 Field Name Reset Type 7:0 cmd_data4 0 W Description Command data 4– see register command Figure 35: CMD_DATA3 Register 0x0c: CMD_DATA3 Field Name Reset Type Description 7:0 cmd_data3 0 W Command data 3 – see register command Figure 36: CMD_DATA2 Register 0x0d: CMD_DATA2 Field Name Reset Type Description 7:0 cmd_data2 0 W Command data 2 – see register command Figure 37: CMD_DATA1 Register 0x0e: CMD_
TMF8701 − Register Description Figure 39: COMMAND Register 0x10: COMMAND Field Name Reset Type 7:0 Command 0 RW Description Direct the device to control or select contents of the registers from 0x20...0xDF Setting 0x00 Meaning No command Set flag to perform distance or proximity measurement with 8 bytes of data containing where including setting of calibration (and algorithm state) configuration.
TMF8701 − Register Description 0x10: COMMAND Field Name Reset Type Description Set flag to perform distance or proximity measurement with 7 bytes of data containing where cmd_data6 = Bit mask which algorithm is used Bit 0 - When 1 proximity is enabled Bit 1 - When 1 distance enabled Bits 3:2 - Reserved; set to 00b.
TMF8701 − Register Description 0x10: COMMAND Field Name Reset Type Description cmd_data4 = If cmd_data5 enables VCSEL pulse output for GPIO0 and/or GPIO1, cmd_data4 sets its timings as follows. If set to non-zero, GPIO1 shows the VCSEL pulse; additionally the GPIO1 signal can be set to be asserted before the VCSEL pulse starts ‘0’ - No signal, ‘1’ - GPIOx, rises 0μs time before VCSEL pulse starts ‘2’ - GPIOx rises 100μs before VCSEL pulse, ‘3’ - GPIOx rises 200μs before VCSEL pulse and so on.
TMF8701 − Register Description 0x10: COMMAND Field Name Reset Type Description 0x0A Perform factory calibration in the final customer application including cover glass, no ambient light and no target. The result from the factory calibration is stored from register 0x20 onwards (14 bytes). Set flag to download calibration (and algorithm state) configuration to TMF8701.
TMF8701 − Register Description 0x10: COMMAND Field Name Reset Type Description Enable histogram readout; the internal state machine will stop when a histogram (e.g. calibration) is available and wait for readout by the host.
TMF8701 − Register Description Figure 40: PREVIOUS Register 0x11: PREVIOUS Field Name Reset Type Description 7:0 previousCommand 0 RO Previous command that was executed (or current if continues mode is selected) Figure 41: APPREV_MINOR Register 0x12: APPREV_MINOR Field Name Reset Type 7:0 appRevMinor 0 RO Description Application minor revision Figure 42: APPREV_PATCH Register 0x13: APPREV_PATCH Field Name Reset Type 7:0 appRevPatch 0 RO Reset Type Description Application pat
TMF8701 − Register Description Figure 44: REGISTER_CONTENTS Register 0x1e: REGISTER_CONTENTS Field 7:0 Name Reset register_ contents Type Description RO Current contents of the I²C ram from 0x20 to 0xEF; the coding is as follows: 0Ah ... Calibration data 47h ... Serial Number 55h ... Results for commands 0x02/0x03 and 0x04 80h-93h ... Raw histogram data where 80h=TDC0, bin 0... 63 81h=TDC0, bin 64... 127 82h=TDC0, bin 128... 195 83h=TDC0, bin 196... 255 84h=TDC1, bin 0... 63 ... 93h=TDC4, bin 196.
TMF8701 − Register Description Figure 47: RESULT_INFO Register 0x21: RESULT_INFO Field 5:0 Name Reset Type Description 0 RO Reliability of object - valid range 0 to 63 where 63 is best reliability When algImmediateInterrupt == 1 Will indicate the status of the measurement.
TMF8701 − Register Description Figure 49: DISTANCE_PEAK_1 Register 0x23: DISTANCE_PEAK_1 Field Name Reset Type 7:0 distance_peak[15:8] 0 RO Description Distance to the peak in [mm] of the object, most significant byte The sys clock registers is a running timer information – this value is counting up (and wraps around to 0 again) as long as the internal clock is running.
TMF8701 − Register Description Figure 53: SYS_CLOCK_3 Register 0x27: SYS_CLOCK_3 Field Name Reset Type 7:0 sys_clock[31:24] 0 RO Description System clock/time stamp in units of 0.2μs Algorithm state information is captured in the next registers. To allow resume of operation after power-off, algorithm state can be stored temporarily inside the host and once after power-on of TMF8701 restored to resume operation.
TMF8701 − Register Description Figure 58: STATE_DATA_4 Register 0x2c: STATE_DATA_4 Field Name Reset Type 7:0 state_data_4 0 RO Description Algorithm state data Figure 59: STATE_DATA_5 Register 0x2d: STATE_DATA_5 Field Name Reset Type 7:0 state_data_5 0 RO Description Algorithm state data Figure 60: STATE_DATA_6 Register 0x2e: STATE_DATA_6 Field Name Reset Type 7:0 state_data_6 0 RO Description Algorithm state data Figure 61: STATE_DATA_7 Register 0x2f: STATE_DATA_7 Field Nam
TMF8701 − Register Description Figure 63: STATE_DATA_9 Register 0x31: STATE_DATA_9 Field Name Reset Type 7:0 state_data_9 0 RO Description Algorithm state data Figure 64: STATE_DATA_10 Register 0x32: STATE_DATA_10 Field Name Reset Type 7:0 state_data_10 0 RO Description Algorithm state data Reference hits and object hits are used for information purposes of the target object and are only reported if a target is detected with the distance algorithm.
TMF8701 − Register Description Figure 67: REFERENCE_HITS_2 Register 0x35: REFERENCE_HITS_2 Field 7:0 Name Reset Type Description 0 RO Sum of the reference SPADs hits during the distance measurement; zero if no object is detected or distance algorithm is no used reference_hits[23:16] Figure 68: REFERENCE_HITS_3 Register 0x36: REFERENCE_HITS_3 Field Name Reset Type Description 7:0 reference_hits[31:24] 0 RO Sum of the reference SPADs hits during the distance measurement; zero if no object
TMF8701 − Register Description Figure 71: OBJECT_HITS_2 Register 0x39: OBJECT_HITS_2 Field Name Reset Type Description 7:0 object_hits[23:16] 0 RO Sum of the reference SPADs hits during the distance measurement; zero if no object is detected or distance algorithm is no used Reset Type Description 0 RO Sum of the reference SPADs hits during the distance measurement; zero if no object is detected or distance algorithm is no used Figure 72: OBJECT_HITS_3 Register 0x3a: OBJECT_HITS_3 Field 7:
TMF8701 − Register Description Figure 75: FACTORY_CALIB_2 Register 0x22: FACTORY_CALIB_2 Field Name Reset Type 7:0 factory_calib_2 0 RW Description Factory calibration data bits[19:12] of crosstalk measurement Figure 76: FACTORY_CALIB_3 Register 0x23: FACTORY_CALIB_3 Field Name Reset Type 7:0 factory_calib_3 0 RW Description Factory calibration data Figure 77: FACTORY_CALIB_4 Register 0x24: FACTORY_CALIB_4 Field Name Reset Type 7:0 factory_calib_4 0 RW Description Factory calib
TMF8701 − Register Description Figure 80: FACTORY_CALIB_7 Register 0x27: FACTORY_CALIB_7 Field Name Reset Type 7:0 factory_calib_7 0 RW Description Factory calibration data Figure 81: FACTORY_CALIB_8 Register 0x28: FACTORY_CALIB_8 Field Name Reset Type 7:0 factory_calib_8 0 RW Description Factory calibration data Figure 82: FACTORY_CALIB_9 Register 0x29: FACTORY_CALIB_9 Field Name Reset Type 7:0 factory_calib_9 0 RW Description Factory calibration data Figure 83: FACTORY_CALIB
TMF8701 − Register Description Figure 85: FACTORY_CALIB_12 Register 0x2c: FACTORY_CALIB_12 Field Name Reset Type 7:0 factory_calib_12 0 RW Description Factory calibration data Figure 86: FACTORY_CALIB_13 Register 0x2d: FACTORY_CALIB_13 Field Name Reset Type 7:0 factory_calib_13 0 RW Description Factory calibration data If algorithm state data is sent to TMF8701 following registers shall be pre-loaded by the host before command=0x02 or 0x0B is executed.
TMF8701 − Register Description Figure 89: STATE_DATA_WR_2 Register 0x30: STATE_DATA_WR_2 Field Name Reset Type 7:0 state_data_wr_2 0 RW Description Algorithm state data Figure 90: STATE_DATA_WR_3 Register 0x31: STATE_DATA_WR_3 Field Name Reset Type 7:0 state_data_wr_3 0 RW Description Algorithm state data Figure 91: STATE_DATA_WR_4 Register 0x32: STATE_DATA_WR_4 Field Name Reset Type 7:0 state_data_wr_4 0 RW Description Algorithm state data Figure 92: STATE_DATA_WR_5 Register
TMF8701 − Register Description Figure 94: STATE_DATA_WR_7 Register 0x35: STATE_DATA_WR_7 Field Name Reset Type 7:0 state_data_wr_7 0 RW Description Algorithm state data Figure 95: STATE_DATA_WR_8 Register 0x36: STATE_DATA_WR_8 Field Name Reset Type 7:0 state_data_wr_8 0 RW Description Algorithm state data Figure 96: STATE_DATA_WR_9 Register 0x37: STATE_DATA_WR_9 Field Name Reset Type 7:0 state_data_wr_9 0 RW Description Algorithm state data Figure 97: STATE_DATA_WR_10 Register
TMF8701 − Register Description Raw Histogram Output – If Register register_contents= 0x80 …0x93 Figure 98: HISTOGRAM_START Register 0x20: HISTOGRAM_START Field Name Reset Type 7:0 hist_start 0 RW Description Quarter of histogram first byte ...all bytes until...
TMF8701 − Register Description Serial Number Readout – If Register register_contents=0x47 Figure 100: SERIAL_NUMBER_0 Register 0x28: SERIAL_NUMBER_0 Field Name Reset Type 7:0 serial_number_0 0 RW Description Serial number byte 0 Figure 101: SERIAL_NUMBER_1 Register 0x29: SERIAL_NUMBER_1 Field Name Reset Type 7:0 serial_number_1 0 RW Description Serial number byte 1 Figure 102: IDENTIFICATION_NUMBER_0 Register 0x2A: IDENTIFICATION_NUMBER_0 Field Name Reset Type 7:0 identification_n
TMF8701 − Register Description Bootloader Registers – appid=0x80 Following registers are only available if appid=0x80 (Bootloader): Figure 104: BL_CMD_STAT Register 0x08: BL_CMD_STAT Field Name 7:0 bl_cmd_stat Reset Type Description 0 RW Write: Bootloader Command – see section Bootloader commands Read: Bootloader Status – anything else than 0x00 means an error Description Figure 105: BL_SIZE Register 0x09: BL_SIZE Field Name Reset Type 6:0 bl_size 0 RW Data size in bytes Figure 106: B
TMF8701 − Register Description Bootloader Commands The following commands (bl_cmd_stat) are supported by the bootloader: Figure 108: Bootloader Commands Commands Value Meaning RAMREMAP_RESET 0x11 Remap RAM to address 0 and reset DOWNLOAD_INIT 0x14 Initialize for RAM download from host to TMF8701 W_RAM 0x41 Write RAM region (Plain = not encoded into e.g.
TMF8701 − Register Description DOWNLOAD_INIT This command is used to initialize the download HW for secure devices. Figure 110: DOWNLOAD_INIT Command Address Value BL_CMD_STAT 0x14 BL_SIZE 1 BL_DATA0 0..0xFF BL_CSUM 0..0xFF Meaning Initialize the HW for download from host to TMF8701 RAM Seed W_RAM This command writes the given data to a defined RAM region. Note that the RAM pointer has first to be set by the command ADDR_RAM.
TMF8701 − Register Description ADDR_RAM This command is to specify the RAM pointer location for the next R_RAM or W_RAM command. Figure 112: ADDR_RAM Command Address Value BL_CMD_STAT 0x43 BL_SIZE 2 BL_DATA0 0... 0xFF LSB of address in RAM BL_DATA1 0... 0xFF MSB of address in RAM BL_CSUM 0... 0xFF ams Datasheet [v1-08] 2020-Jun-29 Meaning Specify the address of the next RAM read or write.
TMF8701 − Application Information Application Information SPAD Options Signal SPADs Firmware can enable/disable SPADs in the array as needed. Figure 113: Signal SPADs Min Typ Max 1x SPADS 72 10x Attenuated SPADs 16 100x Attenuated SPADs 16 Comments Physically there are 4x32=128 signal SPADs, but SPADs with too high dark count rate are disabled during production test. There are four TDCs (TDC1 …TDC4) connected to the output of the SPADs.
TMF8701 − Application Information Reference SPAD, TDC and Histogram There is an internal reference SPAD with associated TDC and histogram. This is used to determine the start time of each pulse. The reference SPAD is processed during calibration. The reference channel processing occurs internal to the device with no user interaction required. All histograms can be processed inside the TMF8701 and/or readout through the I²C interface.
TMF8701 − Application Information Schematic The TMF8701 needs only 3 small 0402 external capacitors for operation: Figure 116: TMF8701 Application Schematic 0.1µF/6V3 High Power Illuminator SYNC Host VIO VDD VDDV GNDV TMF8701 GPIO1 GPIO0 Driver EN INT Control SDA SCL Data Process VDD VDD Optics SPAD, TDC and Histogram GND GNDC 2x 0.
TMF8701 − Application Information PCB Layout Figure 117: PCB Layout Recommendation GND PLANE VDD CVDDC VDDC VDDV CVDDV VDD (0402) (0402) GNDC GNDV (0402) GPIO0 GPIO1 INT INT EN EN SCL SCL GND GND SDA SDA VDD GPIO0 GND GPIO1 CVDD GND (0402) VDD Use GRM155R70J104KA01 (0402 X7R 0.1μF 6.3V) or capacitors with same or better performance for C VDDC , C VDD and C VDDV.
TMF8701 − Application Information PCB Pad Layout Figure 118: PCB Pad Layout ; ; ; &/ ; ; &/ ; Note(s): 1. All linear dimensions are in millimeters. 2. Dimension tolerances are 0.05mm unless otherwise noted. 3. This drawing is subject to change without notice. Use the PCB pad layout as a recommendation only. The actual pad layout shall be optimized for the customer production line.
TMF8701 − Package Information Package Information Figure 119: Package Drawing 5[ $SHUWXUH 3,1 % 3,1 &/ 3,1 ; 5 7[ $SHUWXUH &/ & $ % 3,1 0$5. $ &/ & ; ; ; 3,1 ; 0 & $ % ; ; ; ; 0 & $ % RoHS Green Note(s): 1. All linear dimensions are in millimeters. 2. Contact finish is Au/Ni 3.
TMF8701 − Tape & Reel Information Tape & Reel Information Figure 120: Tape and Reel Drawing Note(s): 1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted. 2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing A0, B0, and K0 are defined in ANSI EIA Standard 481-B 2001. 4. There are two reel sizes available (see section Ordering Information) a.
TMF8701 − Soldering & Storage Information Soldering & Storage Information Soldering Information The package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The process, equipment, and materials used in these test are detailed below. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component.
TMF8701 − Soldering & Storage Information Figure 122: Solder Reflow Profile Parameter Reference Average temperature gradient in preheating Device 2.
TMF8701 − Soldering & Storage Information Floor Life The module has been assigned a moisture sensitivity level of MSL 3.
TMF8701 − Laser Eye Safety Laser Eye Safety The TMF8701 is designed to meet the Class 1 laser safety limits including single faults in compliance with IEC/EN 60825-1:2014 and IEC/EN 60825-1:2007. This applies to the stand-alone device and the included software supplied by ams. In an end application system environment, the system may need to be tested to ensure it remains compliant.
TMF8701 − Ordering & Contact Information Ordering & Contact Information Figure 123: Ordering Information Ordering Code Package Marking Optical Module 5-Digit Tracecode (coded) TMF8701-1XM TMF8701-1X Delivery Form Delivery Quantity Tape & Reel (7") 500 parts/reel Tape & Reel (13") 5000 parts/reel Note(s): 1. Where X=ROM version (A-Z). Buy our products or get free samples online at: www.ams.com/Products Technical Support is available at: www.ams.
TMF8701 − RoHS Compliant & ams Green Statement RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories plus additional 4 substance categories (per amendment EU 2015/863), including the requirement that lead not exceed 0.1% by weight in homogeneous materials.
TMF8701 − Copyrights & Disclaimer Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade.
TMF8701 − Document Status Document Status Document Status Product Preview Preliminary Datasheet Datasheet Datasheet (discontinued) Page 62 Document Feedback Product Status Definition Pre-Development Information in this datasheet is based on product ideas in the planning phase of development.
TMF8701 − Revision Information Revision Information Changes from 1-07 (2020-Apr-28) to current revision 1-08 (2020-Jun-29) Added Laser Eye Safety logo Page 58 Note(s): 1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision. 2. Correction of typographical errors is not explicitly mentioned.
TMF8701 − Content Guide Content Guide 1 1 2 2 General Description Key Benefits & Features Applications Block Diagram 3 3 3 Pin Assignments Pin Diagram Pin Description 5 Absolute Maximum Ratings 7 7 Electrical Characteristics Recommended Operating Conditions 8 Typical Operating Characteristics 10 10 11 11 11 12 13 13 14 14 14 14 15 16 16 17 17 Detailed Description I²C Protocol TOF Description System Parameters I/O Power Consumption Timing Ranging Acquisition Timing Reset Pin and Power-Up Timing
TMF8701 − Content Guide ams Datasheet [v1-08] 2020-Jun-29 48 48 48 48 49 50 51 52 Application Information SPAD Options Signal SPADs Reference SPADs Reference SPAD, TDC and Histogram Schematic PCB Layout PCB Pad Layout 53 54 Package Information Tape & Reel Information 55 55 56 56 56 57 57 Soldering & Storage Information Soldering Information Storage Information Moisture Sensitivity Shelf Life Floor Life Rebaking Instructions 58 59 60 61 62 63 Laser Eye Safety Ordering & Contact Information RoHS Comp
