Datasheet

Datasheet
BMM150 Geomagnetic Sensor
Page 48
BST-BMM150-DS001-01 | Revision 1.0 | April 2013 Bosch Sensortec
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third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
9.2 Landing pattern recommendation
For the design of the landing pattern, we recommend the following dimensioning:
To be discussed
0.283
1
.
56
0.283
E1
D2
D4
E5
C5
A5
B4
C1
A1
B2
0.4
0.798
0.4
0.2
0.283 0.283
0.762
0.762 0.798
1.56
0.035
0.035
A3
E3
Figure 24: Landing patterns relative to the device pins, dimensions are in mm
Note: Recommended thickness of solder paste is 100µm.
The land pattern depicted in Figure 24 may be used similarly for PCBs designed with NSMD as
well as SMD process.
For the NSMD process, landing dimensions as in Figure 24 should be defined in the metal layer
while the solder mask openings should be larger than the defined metal pads.
In case of SMD process, land dimensions should be defined by solder mask which openings are
smaller than underlying metal pads.
Land Pattern is presented as guideline; designer should always use their own experience.
Choice between SMD and NSMD is determined by customer.