Datasheet

Datasheet
BMM150 Geomagnetic Sensor
Page 45
BST-BMM150-DS001-01 | Revision 1.0 | April 2013 Bosch Sensortec
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third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
8. Package
Original drawing?
8.1 Outline dimensions
The sensor housing is 12 pin chip scale wafer level package (1.56 × 1.56 × 0.6 mm
3
). Its
dimensions are the following:
Figure 20: Package outline dimensions in µm
Bottom view
(Bumps visible)
TOP view
(Bumps not visible)
Side view
400
12 x Ø250
195
A1 corner
566
566
283 283 283 283
283283283283
VDD GND
CSB
SDI
GND
SCK
INT
VDDIO
GND SDO
PS
DRY
1560 ± 30
1560 ± 30
1
2
3
4
5
ABCDE
566
566
283 283 283 283
283283283283
VDD GND CSB
SDI
GND SCK
INT VDDIO
GND SDO PS
DRY
1560 ± 30
1560 ± 30
5
4
3
2
1
ABCDE
A1 corner
35
35