Data Sheet

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1. General description

NXP has developed the Mifare MF1 IC S50 to be used in contactess smart cards

according to ISO/IEC 14443A. The communication layer ( Mifare RF Interface) complies

to parts 2 and 3 of the ISO/IEC 14443A standard. The security layer sports the field

proven CRYPTO1 stream cipher for secure data exchange of the Mifare Classic family.

1.1 Contactless Energy and Data Transfer

In the Mifare system, the MF1 IC S50 is connected to a coil with a few turns and then

embedded in plastic to form the passive contactless smart card. No battery is needed.

When the card is positioned in the proximity of the Read Write Device (RWD) antenna, the

high speed RF communication interface allows to transmit data with 106 kBit/s.

1.2 Anticollision

An intelligent anticollision function allows to operate more than one card in the field

simultaneously. The anticollision algorithm selects each card individually and ensures that

the execution of a transaction with a selected card is performed correctly without data

corruption resulting from other cards in the field.

MF1 IC S50

Functional specification

Rev. 5.2 — 15 January 2007 Product data sheet

001052 PUBLIC

Fig 1. Mifare card reader

contacts La , Lb

4 turns wire coil

MF1 IC S50 chip

embedded into a module

Mifare card

Energy

Data

Mifare card reader

Summary of content (17 pages)

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MF1 IC S50 Functional specification Rev. 5.2 — 15 January 2007 Product data sheet 001052 PUBLIC 1. General description NXP has developed the Mifare MF1 IC S50 to be used in contactess smart cards according to ISO/IEC 14443A. The communication layer ( Mifare RF Interface) complies to parts 2 and 3 of the ISO/IEC 14443A standard. The security layer sports the field proven CRYPTO1 stream cipher for secure data exchange of the Mifare Classic family. 1.
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MF1 IC S50 NXP Semiconductors Functional specification 1.3 User Convenience The Mifare system is designed for optimal user convenience. The high data transmission rate for example allows complete ticketing transactions to be handled in less than 100 ms. Thus, the Mifare‚ card user is not forced to stop at the RWD antenna leading to a high throughput at gates and reduced boarding times onto busses. The Mifare card may also remain in the wallet during the transaction, even if there are coins in it. 1.
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MF1 IC S50 NXP Semiconductors Functional specification 2.3 Security Mutual three pass authentication (ISO/IEC DIS 9798-2) Data encryption on RF-channel with replay attack protection Individual set of two keys per sector (per application) to support multi-application with key hierarchy Unique serial number for each device Transport key protects access to EEPROM on chip delivery 3. Ordering information See Delivery Type Addendum of Device 4.
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MF1 IC S50 NXP Semiconductors Functional specification 6. Functional description 6.1 Block description The MF1 IC S50 chip consists of the 1 Kbyte EEPROM, the RF-Interface and the Digital Control Unit. Energy and data are transferred via an antenna, which consists of a coil with a few turns directly connected to the MF1 IC S50. No further external components are necessary. (For details on antenna design please refer to the document Mifare‚ Card IC Coil Design Guide.
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MF1 IC S50 NXP Semiconductors Functional specification 6.2.3 Select card With the select card command the RWD selects one individual card for authentication and memory related operations. The card returns the Answer To Select (ATS) code (= 08h), which determines the type of the selected card. Please refer to the document MIFARE‚ Standardized Card Type Identification Procedure for further details. 6.2.
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MF1 IC S50 NXP Semiconductors Functional specification 6.2.
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MF1 IC S50 NXP Semiconductors Functional specification 6.5 RF interface The RF-interface is according to the standard for contactless smart cards ISO/IEC 14443A. The carrier field from the RWD is always present (with short pauses when transmitting), because it is used for the power supply of the card. For both directions of data communication there is only one start bit at the beginning of each frame. Each byte is transmitted with a parity bit (odd parity) at the end.
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MF1 IC S50 NXP Semiconductors Functional specification 6.6.1 Manufacturer block This is the first data block (block 0) of the first sector (sector 0). It contains the IC manufacturer data. Due to security and system requirements this block is write protected after having been programmed by the IC manufacturer at production. MSB LSB x x x x x x x 0 Byte 0 1 2 3 4 5 6 7 Serial Number 8 9 10 11 12 13 14 15 Manufacturer Data Check Byte Fig 5. Manufacturer block 6.6.
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MF1 IC S50 NXP Semiconductors Functional specification • Adr: Signifies a 1-byte address, which can be used to save the storage address of a block, when implementing a powerful backup management. The address byte is stored four times, twice inverted and non-inverted. During increment, decrement, restore and transfer operations the address remains unchanged. It can only be altered via a write command.
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MF1 IC S50 NXP Semiconductors Functional specification 6.7 Memory access Before any memory operation can be carried out, the card has to be selected and authenticated as described previously.The possible memory operations for an addressed block depend on the key used and the access conditions stored in the associated sector trailer.
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MF1 IC S50 NXP Semiconductors Functional specification Table 1.
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MF1 IC S50 NXP Semiconductors Functional specification Fig 9. Access conditions 6.7.2 Access conditions for the sector trailer Depending on the access bits for the sector trailer (block 3) the read/write access to the keys and the access bits is specified as ‘never’, ‘key A’, ‘key B’ or key A|B’ (key A or key B). On chip delivery the access conditions for the sector trailers and key A are predefined as transport configuration.
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MF1 IC S50 NXP Semiconductors Functional specification Table 3.
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MF1 IC S50 NXP Semiconductors Functional specification Table 4.
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MF1 IC S50 NXP Semiconductors Functional specification 12. Revision history Table 5. Revision history Document ID Release date Data sheet status Change notice 15 January 2007 Product data sheet Modifications: 5.1 • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name. 001052 Product data sheet Supersedes © NXP B.V. 2007. All rights reserved. Rev. 5.
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MF1 IC S50 NXP Semiconductors Functional specification 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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MF1 IC S50 NXP Semiconductors Functional specification 15. Tables Table 1. Table 2. Table 3. Memory Operations . . . . . . . . . . . . . . . . . . . . . 11 Access conditions . . . . . . . . . . . . . . . . . . . . . . . 11 Access conditions for the sector trailer . . . . . .13 Table 4. Table 5. Access conditions for data blocks . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 16. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Mifare card reader . . . . . . . . .