Datasheet

ST7735
V1.7 4 2009-12-04
3.3 Alignment Mark Dimension
80
80 2015 1515 15
105
2015 1515 15
80
80 20 1515 1515
10 5
20 1515 1515
3.4 Chip Information
Chip size (um x um): 9900 x 670
PAD coordinate: pad center
Coordinate origin: chip center
Chip thickness (um): 300 (TYP)
Bump height (um): 15 (TYP)
Bump hardness (HV): 75 (TYP)