ESP32C3MINI1 ESP32C3MINI1U Datasheet Smallsized 2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 module Built around ESP32C3 series of SoCs, RISCV singlecore microprocessor 4 MB flash in chip package 15 GPIOs Onboard PCB antenna or external antenna connector Version1.0 Espressif Systems Copyright © 2021 www.espressif.
1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/sites/default/files/documentation/esp32-c3-mini-1_datasheet_en.pdf 1.1 Features the Station channel CPU and OnChip Memory • Antenna diversity • ESP32-C3FH4 or ESP32-C3FN4 embedded, 32-bit RISC-V single-core processor, up to 160 • 802.
1 Module Overview – 85 °C version module: –40 ~ 85 °C • Green certification: RoHS/REACH – 105 °C version module: –40 ~ 105 °C Certification Test • RF certification: FCC/CE/SRRC • HTOL/HTSL/uHAST/TCT/ESD/Latch-up 1.2 Description ESP32-C3-MINI-1 and ESP32-C3-MINI-1U are two general-purpose Wi-Fi and Bluetooth LE modules. The rich set of peripherals and a small size make the two modules an ideal choice for smart homes, industrial automation, health care, consumer electronics, etc.
1 Module Overview 1.
Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Description 3 1.3 Applications 4 2 Block Diagram 8 3 Pin Definitions 9 3.1 Pin Layout 9 3.2 Pin Description 9 3.3 Strapping Pins 10 4 Electrical Characteristics 13 4.1 Absolute Maximum Ratings 13 4.2 Recommended Operating Conditions 13 4.3 DC Characteristics (3.3 V, 25 °C) 13 4.4 Current Consumption Characteristics 14 4.5 Wi-Fi Radio 15 4.5.1 Wi-Fi RF Standards 15 4.5.
List of Tables List of Tables 1 Ordering Information 3 2 Pin Definitions 9 3 Strapping Pins 11 4 Parameter Descriptions of Setup and Hold Times for the Strapping Pin 12 5 Absolute Maximum Ratings 13 6 Recommended Operating Conditions 13 7 DC Characteristics (3.3 V, 25 °C) 13 8 Current Consumption Depending on RF Modes 14 9 Current Consumption Depending on Work Modes 14 10 Wi-Fi RF Standards 15 11 TX Power with Spectral Mask and EVM Meeting 802.
List of Figures List of Figures 1 ESP32-C3-MINI-1 Block Diagram 8 2 ESP32-C3-MINI-1U Block Diagram 8 3 Pin Layout (Top View) 9 4 Setup and Hold Times for the Strapping Pin 12 5 ESP32-C3-MINI-1 Schematics 22 6 ESP32-C3-MINI-1U Schematics 23 7 Peripheral Schematics 24 8 ESP32-C3-MINI-1 Physical Dimensions 25 9 ESP32-C3-MINI-1U Physical Dimensions 25 10 ESP32-C3-MINI-1 Recommended PCB Land Pattern 26 11 ESP32-C3-MINI-1U Recommended PCB Land Pattern 27 12 Dimensions of Externa
2 Block Diagram 2 Block Diagram ESP32-C3-MINI-1 40 MHz Crystal 3V3 Antenna RF Matching EN ESP32-C3FN4 ESP32-C3FH4 GPIOs SPI Flash Figure 1: ESP32C3MINI1 Block Diagram ESP32-C3-MINI-1U 40 MHz Crystal 3V3 Antenna RF Matching EN ESP32-C3FN4 ESP32-C3FH4 GPIOs SPI Flash Figure 2: ESP32C3MINI1U Block Diagram Espressif Systems 8 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v1.
3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 7.1 Physical Dimensions.
3 Pin Definitions Table 2 – cont’d from previous page Name No. 1 Type Function 4, 7, 9, 10, NC 15, 17, 24, 25, 28, 29, — NC 32-35 IO2 5 I/O/T GPIO2, ADC1_CH2, FSPIQ IO3 6 I/O/T GPIO3, ADC1_CH3 High: on, enables the chip. EN 8 I Low: off, the chip powers off. Note: Do not leave the EN pin floating.
3 Pin Definitions • power-on-reset • RTC watchdog reset • brownout reset • analog super watchdog reset • crystal clock glitch detection reset By default, GPIO9 is connected to the internal pull-up resistor.
3 Pin Definitions t0 CHIP_EN t1 VIL_nRST VIH Strapping pin Figure 4: Setup and Hold Times for the Strapping Pin Table 4: Parameter Descriptions of Setup and Hold Times for the Strapping Pin Min Parameter Description t0 Setup time before CHIP_EN goes from low to high 0 t1 Hold time after CHIP_EN goes high 3 Espressif Systems (ms) 12 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v1.
4 Electrical Characteristics 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
4 Electrical Characteristics Table 7 – cont’d from previous page Symbol Parameter VIL_nRST Min Chip reset voltage Typ –0.3 1 VDD is the I/O voltage for a particular power domain of pins. 2 VOH and VOL are measured using high-impedance load. — Max Unit 0.25 × VDD 1 V 4.4 Current Consumption Characteristics With the use of advanced power-management technologies, the module can switch between different power modes.
4 Electrical Characteristics 4.5 WiFi Radio 4.5.1 WiFi RF Standards Table 10: WiFi RF Standards Name Description Center frequency range of operating channel 1 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 11b: 1, 2, 5.5 and 11 Mbps 20 MHz Data rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 11n: MCS0-7, 72.
4 Electrical Characteristics Table 12 – cont’d from previous page Rate Min Typ SL1 (dB) (dB) (dB) 802.11n, HT40, MCS0, @18.5 dBm — –26.5 –5 802.11n, HT40, MCS7, @17 dBm — –30.5 –27 1 SL stands for standard limit value. 4.5.3 WiFi RF Receiver (RX) Specifications Table 13: RX Sensitivity Min Typ Max (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –98.0 — 802.11b, 2 Mbps — –96.0 — 802.11b, 5.5 Mbps — –93.0 — 802.11b, 11 Mbps — –88.6 — 802.11g, 6 Mbps — –92.8 — 802.
4 Electrical Characteristics Table 14: Maximum RX Level Min Typ Max (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — 802.11n, HT40, MCS0 — 5 — 802.11n, HT40, MCS7 — 0 — Rate Table 15: RX Adjacent Channel Rejection Rate Min Typ Max (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.
4 Electrical Characteristics Table 17: Transmitter Characteristics Bluetooth LE 1 Mbps Parameter Description In-band emissions Modulation characteristics Carrier frequency offset Carrier frequency drift Min Typ Max Unit F = F0 ± 2 MHz — –37.62 — dBm F = F0 ± 3 MHz — –41.95 — dBm F = F0 ± > 3 MHz — –44.48 — dBm ∆ f 1avg — 245.00 — kHz ∆ f 2max — 208.00 — kHz ∆ f 2avg /∆ f 1avg — 0.93 — — — — –9.00 — kHz |f0 − fn |n=2, 3, 4, ..k — 1.17 — kHz |f1 − f0 | — 0.
4 Electrical Characteristics Table 20: Transmitter Characteristics Bluetooth LE 500 Kbps Parameter Description In-band emissions Modulation characteristics Carrier frequency offset Carrier frequency drift Min Typ Max Unit F = F0 ± 2 MHz — –37.90 — dBm F = F0 ± 3 MHz — –41.30 — dBm F = F0 ± > 3 MHz — –42.80 — dBm ∆ f 2avg — 220.00 — kHz ∆ f 2max — 205.00 — kHz — — –11.90 — kHz |f0 − fn |n=1, 2, 3, ..k — 1.37 — kHz |f0 − f3 | — 1.
4 Electrical Characteristics Table 22: Receiver Characteristics Bluetooth LE 2 Mbps Parameter Description Min Sensitivity @30.8% PER — — –93 — dBm Maximum received signal @30.
4 Electrical Characteristics Table 24 – cont’d from previous page Parameter Description Maximum received signal @30.
5 Module Schematics This is the reference5 design of the module. 4 3 2 1 3 1 GND RF_ANT 1 2 L2 C8 PCB_ANT TBD GND GND 49 48 47 46 45 44 43 42 41 40 39 38 37 36 R1 33 32 31 30 29 28 27 26 25 53 VDD33 1 2 3 4 5 6 7 8 9 10 11 GND TBD C9 TBD GND LNA_IN GPIO0 GPIO1 GPIO2 CHIP_EN GPIO3 1 2 3 4 5 6 7 8 LNA_IN VDD3P3 VDD3P3 XTAL_32K_P XTAL_32K_N GPIO2 CHIP_EN GPIO3 SPIQ SPID SPICLK SPICS0 SPIWP SPIHD VDD_SPI VDD3P3_CPU U2 B 9 10 11 12 13 14 15 16 ESP32-C3-MINI-1 & MINI-1U Datasheet v1.
5 4 3 2 1 3 4 GND XOUT 1 0.1uF GND 4 3 2 1 GND 23 RF_ANT L2 ANT1 C8 IPEX TBD GND 49 48 47 46 45 44 43 42 41 40 39 38 37 36 R1 32 31 30 29 28 27 26 25 1 2 3 4 5 6 7 8 9 10 11 GND TBD C9 TBD GND LNA_IN GPIO0 GPIO1 GPIO2 CHIP_EN GPIO3 1 2 3 4 5 6 7 8 LNA_IN VDD3P3 VDD3P3 XTAL_32K_P XTAL_32K_N GPIO2 CHIP_EN GPIO3 SPIQ SPID SPICLK SPICS0 SPIWP SPIHD VDD_SPI VDD3P3_CPU The values of C8, L2 and C9 vary with the actual PCB board. NC: No component.
6 Peripheral Schematics 4 3 2 6 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). C3 TBD 52 R1 0.1uF IO2 IO3 TBD EN GND ESP32-C3-MINI-1 ESP32-C3-MINI-1U GND GND U1 GND C8 R5 R6 JP4 0(NC) 0(NC) 1 2 3 4 TXD0 RXD0 UART IO19 R4 IO18 R6 USB_D+ USB_D- 0 0 51 GND 12pF(NC) JP1 JTAG NC: No component.
7 Physical Dimensions and PCB Land Pattern 7 Physical Dimensions and PCB Land Pattern 7.1 Physical Dimensions Unit: mm 16.6±0.15 13.2±0.15 0.8 1.45 0.6 11.2 0.6 5.4 1.45 10.6 9.2 9 8.4 7.6 6.8 5 0. Ø 0.62 9.95 11.95 5.4 0.62 8.4 9.2 10 11 11.2 12.6 2.4±0.15 Top view Side view Bottom view Figure 8: ESP32C3MINI1 Physical Dimensions Unit: mm 13.2±0.15 0.8 1.7 0.85 0.6 10.6 9.2 9 8.4 7.6 6.8 11.55 8.7 0.48 5.4 0.47 Top view 0.6 5.4 1.45 1.45 12.25 1.55 12.5±0.15 9.
7 Physical Dimensions and PCB Land Pattern 7.2 Recommended PCB Land Pattern Unit: mm : Pad 13.2 Antenna Area 16.6 1.45 1.45 5.4 0.6 10.6 9.2 9 8.4 7.6 6.8 0.6 11.2 Pin 1 5.4 8.4 9.2 10 11 11.2 12.6 Top view Figure 10: ESP32C3MINI1 Recommended PCB Land Pattern Espressif Systems 26 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v1.
7 Physical Dimensions and PCB Land Pattern Unit: mm : Pad 13.2 Pin 1 12.5 1.45 1.45 5.4 0.6 10.6 9.2 9 8.4 7.6 6.8 0.6 5.4 8.4 9.2 10 11 11.2 12.6 Figure 11: ESP32C3MINI1U Recommended PCB Land Pattern Espressif Systems 27 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v1.
7 Physical Dimensions and PCB Land Pattern 7.3 Dimensions of External Antenna Connector ESP32-C3-MINI-1U uses the third generation external antenna connector as shown in Figure 12. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMMC connector from Amphenol Unit: mm Tolerance: +/-0.1 mm CONTACT 1.7 2.00±0.10 A A GROUND CONTACT 2.05±0.10 0.85 0.57 1.7 CONTACT 1.40 0.
8 Product Handling 8 Product Handling 8.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and /60%RH. If the above conditions are not met, the module needs to be baked. 8.
9 Related Documentation and Resources 9 Related Documentation and Resources Related Documentation • ESP32-C3 Technical Reference Manual – Detailed information on how to use the ESP32-C3 memory and peripherals. • ESP32-C3 Series Datasheet – Specifications of the ESP32-C3 hardware. • Certificates http://espressif.com/en/support/documents/certificates • Documentation Updates and Update Notification Subscription http://espressif.
Revision History Revision History Date Version Release notes • Updated module description on the title page • Deleted Section ”About This Document” • Restructured Section 1.1 Features • Added ordering code in Table 1 Ordering Information 2021-06-21 v1.0 • Added descriptions in Section 7.
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