Datasheet

Preliminary Data Sheet SHT3x-ARP

www.sensirion.com November 2014 - 0.9 7/11

5 Packaging

SHT3x-ARP sensors are provided in a DFN package.

DFN stands for dual flat no leads. The humidity sensor

opening is centered on the top side of the package.

The sensor chip is made of silicon and is mounted to a

lead frame. The latter is made of Cu plated with

Ni/Pd/Au. Chip and lead frame are overmolded by an

epoxy-based mold compound leaving the central die

pad and I/O pins exposed for mechanical and electrical

connection. Please note that the side walls of the

sensor are diced and therefore these diced lead frame

surfaces are not covered with the respective plating.

5.1 Traceability

All SHT3x-ARP sensors are laser marked for easy

identification and traceability. The marking on the

sensor top side consists of a pin-1 indicator and two

lines of text.

The top line consist of the pin-1 indicator which is

located in the top left corner and the product name. The

small letter x stands for the accuracy class.

The bottom line consists of 6 letters. The first two digits

XY (=AR) describe the output mode. The third letter (A)

represents the manufacturing year (4 = 2014, 5 = 2015,

etc). The last three digits (BCD) represent an

alphanumeric tracking code. That code can be decoded

by Sensirion only and allows for tracking on batch level

through production, calibration and testing – and will be

provided upon justified request.

If viewed from below pin 1 is indicated by triangular

shaped cut in the otherwise rectangular die pad. The

dimension of the triangular cut are shown in Figure 11

through the labels T1 & T2.

Figure 10 Top View of the SHT3x-ARP illustrating the

laser marking.

XYABCD

SHT