Data Sheet
Table Of Contents
- 1.0 Device Overview
- 2.0 Can Message Frames
- 3.0 Message Transmission
- 4.0 Message Reception
- 5.0 Bit Timing
- 6.0 Error Detection
- 7.0 Interrupts
- 8.0 Oscillator
- 9.0 RESET
- 10.0 Modes of Operation
- 11.0 Register Map
- 12.0 SPI™ Interface
- 12.1 Overview
- 12.2 Reset Instruction
- 12.3 Read Instruction
- 12.4 Read RX Buffer Instruction
- 12.5 Write Instruction
- 12.6 Load TX Buffer Instruction
- 12.7 Request-To-Send (RTS) Instruction
- 12.8 Read Status Instruction
- 12.9 RX Status Instruction
- 12.10 Bit Modify Instruction
- Figure 12-1: Bit Modify
- Table 12-1: SPI™ Instruction Set
- Figure 12-2: Read instruction
- Figure 12-3: Read RX Buffer Instruction
- Figure 12-4: Byte Write instruction
- Figure 12-5: Load TX Buffer
- Figure 12-6: Request-to-send (RTS) instruction
- Figure 12-7: BIT Modify instruction
- Figure 12-8: Read Status instruction
- Figure 12-9: RX StatUs Instruction
- Figure 12-10: SPI™ Input Timing
- Figure 12-11: SPI™ Output TIming
- 13.0 Electrical Characteristics
- 14.0 PackAging Information
MCP2515
DS21801D-page 76 Preliminary © 2005 Microchip Technology Inc.
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom
1510515105
α
Mold Draft Angle Top
10.929.407.87.430.370.310eBOverall Row Spacing §
0.560.460.36.022.018.014BLower Lead Width
1.781.461.14.070.058.045B1Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
3.433.303.18.135.130.125LTip to Seating Plane
22.9922.8022.61.905.898.890DOverall Length
6.606.356.10.260.250.240E1Molded Package Width
8.267.947.62.325.313.300EShoulder to Shoulder Width
0.38.015A1Base to Seating Plane
3.683.302.92.145.130.115A2Molded Package Thickness
4.323.943.56.170.155.140ATop to Seating Plane
2.54
.100
p
Pitch
1818
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
1
2
D
n
E1
c
eB
β
E
α
p
A2
L
B1
B
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
§ Significant Characteristic