Data Sheet
Table Of Contents
- 1.0 Device Overview
- 2.0 Can Message Frames
- 3.0 Message Transmission
- 4.0 Message Reception
- 5.0 Bit Timing
- 6.0 Error Detection
- 7.0 Interrupts
- 8.0 Oscillator
- 9.0 RESET
- 10.0 Modes of Operation
- 11.0 Register Map
- 12.0 SPI™ Interface
- 12.1 Overview
- 12.2 Reset Instruction
- 12.3 Read Instruction
- 12.4 Read RX Buffer Instruction
- 12.5 Write Instruction
- 12.6 Load TX Buffer Instruction
- 12.7 Request-To-Send (RTS) Instruction
- 12.8 Read Status Instruction
- 12.9 RX Status Instruction
- 12.10 Bit Modify Instruction
- Figure 12-1: Bit Modify
- Table 12-1: SPI™ Instruction Set
- Figure 12-2: Read instruction
- Figure 12-3: Read RX Buffer Instruction
- Figure 12-4: Byte Write instruction
- Figure 12-5: Load TX Buffer
- Figure 12-6: Request-to-send (RTS) instruction
- Figure 12-7: BIT Modify instruction
- Figure 12-8: Read Status instruction
- Figure 12-9: RX StatUs Instruction
- Figure 12-10: SPI™ Input Timing
- Figure 12-11: SPI™ Output TIming
- 13.0 Electrical Characteristics
- 14.0 PackAging Information
© 2005 Microchip Technology Inc. Preliminary DS21801D-page 69
MCP2515
13.0 ELECTRICAL CHARACTERISTICS
13.1 Absolute Maximum Ratings †
VDD.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ..........................................................................................................-0.6V to VDD +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temp. with power applied..........................................................................................................-65°C to +125°C
Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.