User`s manual

www.dfi .comChapter 3 Hardware Installation
23
Chapter 3
Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description
LVDS_A0+ A71
LVDS_A0- A72
LVDS_A1+ A73
LVDS_A1- A74
LVDS_A2+ A75
LVDS_A2- A76
LVDS_A3+ A78
LVDS_A3- A79
LVDS_A_CK+ A81
LVDS_A_CK- A82
LVDS_B0+ B71
LVDS_B0- B72
LVDS_B1+ B73
LVDS_B1- B74
LVDS_B2+ B75
LVDS_B2- B76
LVDS_B3+ B77
LVDS_B3- B78
LVDS_B_CK+ B81
LVDS_B_CK- B82
LVDS_VDD_EN A77 O CMOS 3.3V / 3.3V PD 100K: to GND LVDS panel power enable
LVDS_BKLT_EN B79 O CMOS 3.3V / 3.3V PD 100K: to GND LVDS panel backlight enable
LVDS_BKLT_CTRL B83 O CMOS 3.3V / 3.3V PD 100K: to GND LVDS panel backlight brightness control
LVDS_I2C_CK A83 I/O OD CMOS 3.3V / 3.3V PU 2.2K: to 3.3V I2C clock output for LVDS display use
LVDS_I2C_DAT A84 I/O OD CMOS 3.3V / 3.3V PU 2.2K: to 3.3V I2C data line for LVDS display use
Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description
LPC_AD0 B4
LPC
_
AD1 B5
LPC_AD2 B6
LPC_AD3 B7
LPC_FRAME# B3 O CMOS 3.3V / 3.3V LPC frame indicates the start of an LPC cycle
LPC
_
DR
Q
0# B8
LPC
_
DR
Q
1# B9
LPC_SERIRQ A50 I/O CMOS 3.3V / 3.3V PU 10K:
to 3.3V LPC serial interrupt
LPC_CLK B10 O CMOS 3.3V / 3.3V LPC clock output - 33MHz nominal
Signal Pin# Pin Type Pwr Rail /Tolerance PU/PD Description
SPI_CS# B97 O CMOS 3.3V Suspend/3.3V Chip select for Carrier Board SPI - may be sourced from chipset SPI0 or SPI1
SPI_MISO A92 I CMOS 3.3V Suspend/3.3V Data in to Module from Carrier SPI
SPI_MOSI A95 O CMOS 3.3V Suspend/3.3V Data out from Module to Carrier SPI
SPI_CLK A94 O CMOS 3.3V Suspend/3.3V Clock from Module to Carrier SPI
SPI_POWER A91 O 3.3V Suspend/3.3V
Power supply for Carrier Board SPI – sourced from Module – nominally
3.3V. The Module shall provide a minimum of 100mA on SPI_POWER.
Carriers shall use less than 100mA of SPI_POWER. SPI_POWER
shall only be used to power SPI devices on the Carrier
BIOS_DIS0# A34
BIOS_DIS1# B88
I CMOS 3.3V / 3.3V LPC serial DMA request
SPI Si
g
nals Descri
p
tions
I CMOS NA
Selection straps to determine the BIOS boot device.
The Carrier should only float these or pull them low, please refer to
COM Express Module Base Specification Revision 2.1 for strapping options of BIOS disable signals.
I/O CMOS 3.3V / 3.3V LPC multiplexed address, command and data bus
LVDS Channel A differential clock
O LVDS LVDS
LVDS Channel B differential pairs
O LVDS LVDS
O LVDS LVDS
O LVDS LVDS
O LVDS LVDS
O LVDS LVDS LVDS Channel B differential clock
LPC Si
g
nals Descri
p
tions
LVDS Si
g
nals Descri
p
tions
O LVDS LVDS
LVDS Channel A differential pairs
O LVDS LVDS
O LVDS LVDS
O LVDS LVDS