Specifications
Profiles
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devolo dLAN AVpro manager
3 Profiles
3.1 About profiles
The task of configuring complex dLAN networks can become a laborious and
lengthy one due to the variety and quantity of the dLAN devices to be config-
ured. In the individual dLAN devices of the same dLAN segment or network,
sometimes devices must have the same and sometimes similar configurations. If
a global change is to be carried out in the dLAN (for example, adapting the
dLAN's internal transmitting power in order to prevent the interruption of anoth-
er service network-wide), usually all dLAN devices have to be reconfigured indi-
vidually.
You can make this work significantly easier by creating suitable configuration
profiles with dLAN AVpro manager and then saving every profile under its own
unique name. Then you can quickly and easily assign these profiles as needed
to individual dLAN devices, the MDU segments made up of one master and mul-
tiple slaves, or even complete network trees. In this, the dLAN AVpro manager
provides an ideal basis for an effective application of profiles in all portions of
the dLAN, because it inherently groups dLAN devices into networks and sets up
network hierarchies.
You can predefine the following basic properties of the dLAN devices in the net-
work in configuration profiles:
The limitation of the transfer bandwidth and the activation of the multi-
segment mode
The attenuation of the transmitting power in certain dLAN frequency
bands, in order to prevent interference with other services
The prioritisation of data packets
either using the VLAN header bits,
or via the MAC address of the device or via the TCP/UDP port number.
Disabling certain keys, LEDs and the PowerSave mode in some dLAN device
families.
Start by mapping the various requirements in your network or its segments to
different configurations. Then save the settings for these configurations as pro-
files with a unique name. Then, assign these profiles to individual devices, cer-
tain dLAN segments or an entire dLAN network as needed. Chap.4.3.4 includes
additional information on this topic.