Specifications

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EXAMPLE BOARD LAYOUT

68X (0.8)

68X (0.25)

( 7.7)

(9.6)

64X (0.5)

( ) TYP

VIA

0.2

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

(9.6)

(1.19) TYP

(1.19)

TYP

VQFN - 0.9 mm max heightNKE0068A

PLASTIC QUAD FLATPACK - NO LEAD

4214820/A 12/2014

SYMM

LAND PATTERN EXAMPLE

SCALE:8X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED