Datasheet

DS_E36SR3R320_10292013
12
LEADED (Sn/Pb) PROCESS RECOMMENDED TEMPEATURE PROFILE
Note: The temperature refers to the pin of E36SR, measured on the pin +Vout joint.
LEAD FREE (SAC) PROCESS RECOMMENDED TEMPERATURE PROFILE
Temp.
Time
150℃
200℃
100~140 sec.
Time Limited 90 sec.
above 217℃
217℃
Preheat time
Ramp up
max. 3℃/sec.
Ramp down
max. 4℃/sec.
Peak Temp. 240 ~ 245 ℃
25℃
Note: The temperature refers to the pin of E36SR, measured on the pin +Vout joint.
* For modules with through-hole pins and the optional heatspreader, they are intended for wave soldering
assembly onto system boards, please do not subject such modules through reflow temperature profile.