FEATURES High efficiency: 88% @ 3.3V/ 20A Size: 58.4mm x 22.8mm x 9.2mm Industry standard pin out Fixed frequency operation Input UVLO, Output OCP, OVP, and OTP 2250V isolation Basic insulation No minimum load required SMD and through-hole versions (2.30”x0.90”x0.36”) ISO 9001, TL 9000, ISO 14001, QS 9000, OHSAS 18001 certified manufacturing facility UL/cUL 60950-1 (US & Canada) Recognized Delphi Series E36SR, Eighth Brick Family 18~75V in, 3.
TECHNICAL SPECIFICATIONS (TA=25°C, airflow rate=300 LFM, Vin=48Vdc, nominal Vout unless otherwise noted.
ELECTRICAL CHARACTERISTICS CURVES Efficiency Curves Power Dissipation Curves 93 12 90 10 Power loss(W) Efficiency(%) 87 84 81 78 75 18V 24V 48V 75V 72 69 66 63 2 4 6 8 10 12 14 16 18 6 18V 24V 48V 75V 4 2 0 60 0 8 20 Output current(A) Figure 1: Efficiency vs. load current for minimum, nominal, and maximum input voltage at 25°C. 0 2 4 6 8 10 12 14 16 18 20 Output current(A) Figure 2: Power dissipation vs. load current for minimum, nominal, and maximum input voltage at 25°C.
ELECTRICAL CHARACTERISTICS CURVES Figure 4: Turn-on transient at full rated load current (CC mode) (5ms/div). Vin=48V.Top Trace: Vout, 1V/div; Bottom Trace: ON/OFF input, 5V/div. Figure 5: Turn-on transient at zero load current (5ms/div). Vin=48V.Top Trace: Vout, 2V/div; Bottom Trace: ON/OFF input, 5V/div. Figure 6: Turn-on transient at full rated load current (CC mode) (5ms/div). Vin=48V.Top Trace: Vout, 2V/div; Bottom Trace: input voltage, 20V/div.
ELECTRICAL CHARACTERISTICS CURVES Figure 8: Output voltage response to step-change in load current (50%-25% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF, tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (100mV/div, 100us/div), Bottom Trace: I out (5A/div). Figure 9: Output voltage response to step-change in load current (25%-50% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF, tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (100mV/div, 10us/div), Bottom Trace: I out (5A/div).
ELECTRICAL CHARACTERISTICS CURVES Copper Strip Vo(+) 10u 1u SCOPE RESISTIVE LOAD Vo(-) Figure 12: Input reflected ripple current, is, through a 12µH source inductor at 48Vin and 20 output current (20 mA/div, 2us/div). Figure 13: Output voltage noise and ripple measurement test setup. 3.6 Output voltage (V) 3 2.4 1.8 1.2 0.6 18 24 48 75 0 20 20.4 20.8 21.2 21.6 22 22.4 22.8 23.2 23.6 24 24.4 24.
DESIGN CONSIDERATIONS Input Source Impedance The impedance of the input source connecting to the DC/DC power modules will interact with the modules and affect the stability. A low ac-impedance input source is recommended. If the source inductance is more than a few μH, we advise adding a 10 to 100 μF electrolytic capacitor (ESR < 0.7 Ω at 100 kHz) mounted close to the input of the module to improve the stability.
FEATURES DESCRIPTIONS Vi(+) Vo(+) Over-Current Protection Sense(+) The modules include an internal output over-current protection circuit, which will endure current limiting for an unlimited duration during output overload. If the output current exceeds the OCP set point, the modules will automatically shut down (hiccup mode). The modules will try to restart after shutdown. If the overload condition still exists, the module will shut down again.
FEATURES DESCRIPTIONS (CON.) Output Voltage Adjustment (TRIM) To increase or decrease the output voltage set point, the modules may be connected with an external resistor between the TRIM pin and either the SENSE(+) or SENSE(-). The TRIM pin should be left open if this feature is not used.
THERMAL CONSIDERATIONS Thermal Derating Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer. Heat can be removed by increasing airflow over the module. The hottest point temperature of the module is to be defined.
PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL RECOMMENDED PAD LAYOUT (SMD) DS_E36SR3R320_10292013 11
LEADED (Sn/Pb) PROCESS RECOMMENDED TEMPEATURE PROFILE Note: The temperature refers to the pin of E36SR, measured on the pin +Vout joint. LEAD FREE (SAC) PROCESS RECOMMENDED TEMPERATURE PROFILE Temp. Peak Temp. 240 ~ 245 ℃ 217℃ Ramp down max. 4℃/sec. 200℃ 150℃ Preheat time 100~140 sec. Time Limited 90 sec. above 217℃ Ramp up max. 3℃/sec. 25℃ Time Note: The temperature refers to the pin of E36SR, measured on the pin +Vout joint.
MECHANICAL DRAWING (WITHOUT HEATSPREADER) Surface-mount module Pin No.
MECHANICAL DRAWING (WITH HEATSPREADER) * For modules with through-hole pins and the optional heatspreader, they are intended for wave soldering assembly onto system boards, please do not subject such modules through reflow temperature profile.
PART NUMBERING SYSTEM E 36 S R 3R3 20 Type of Product Input Voltage Number of Outputs Product Series Output Voltage Output Current E- Eighth 36-18~75V S - Single Brick R - Regular 3R3 - 3.3V 20 -20A N R F ON/OFF Pin Logic Length/Type NNegative R - 0.