Datasheet

DS_DNM10SMD10_07182012
13
PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL
LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
Note: All temperature refers to assembly application board, measured on the land of assembly application board.
Temp.
Time
150℃
200℃
90~120 sec.
Time Limited 75 sec.
above 220℃
220℃
Preheat time
Ramp up
max. 3℃ /sec.
Ramp down
max. 4℃ /sec.
Peak Temp. 240 ~ 245 ℃
25℃