Integration Guide
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Power management
- 1.6 System functions
- 1.7 RF connection
- 1.8 SIM interface
- 1.9 Serial Communication
- 1.10 Audio
- 1.11 ADC input (LEON-G100 only)
- 1.12 General Purpose Input/Output (GPIO)
- 1.13 M2M Setup Schematic Example
- 1.14 Approvals
- 2 Design-In
- 3 Handling and soldering
- 4 Product Testing
- Appendix
- A Extra Features
- B Glossary
- Related documents
- Revision history
- Contact
LEON-G100/G200 - System Integration Manual
GSM.G1-HW-09002-F3 Preliminary Handling and soldering
Page 93 of 101
3.2.10 Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such
processes in combination with the LEON-G100/G200 module before implementing this in the production.
Casting will void the warranty.
3.2.11 Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the
EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide
optimum immunity to interferences and noise.
u-blox gives no warranty for damages to the LEON-G100/G200 module caused by soldering metal
cables or any other forms of metal strips directly onto the EMI covers.
3.2.12 Use of ultrasonic processes
Some components on the LEON-G100/G200 module are sensitive to Ultrasonic Waves. Use of any Ultrasonic
Processes (cleaning, welding etc.) may cause damage to the module.
u-blox gives no warranty against damages to the LEON-G100/G200 module caused by any Ultrasonic
Processes.