Integration Guide

Table Of Contents
LEON-G100/G200 - System Integration Manual
GSM.G1-HW-09002-F3 Preliminary Design-In
Page 87 of 101
2.5 ESD Immunity Test Precautions
The immunity to EMS phenomenon Electrostatic Discharge of the device (i.e. the application board where the
module is mounted) must be certified complying the testing requirements standard [9] and the requirements for
radio and digital cellular radio telecommunications system equipments standards [10] [11].
The ESD test is performed at the enclosure port [10] referred as the physical boundary through which EM field
radiates. If the device implements an integral antenna [10] the enclosure is intended as all insulating surfaces
housing the device. If the device implements a removable antenna [10] the enclosure port is limited to the
antenna port [10] hence the enclosure port comprises the antenna element and its interconnecting cable
surfaces.
The applicability of the ESD test depends to the device classification [10], as well the test on other ports [10] or
on interconnecting cables to auxiliary equipments depends to the device accessible interfaces and manufacturer
requirements.
Contact discharges [9] are performed at conductive surfaces whereas air discharges [9] are performed at
insulating surfaces. Indirect contact discharges are performed to the measurement setup horizontal and vertical
coupling planes [9].
In order to satisfy ESD immunity test requirements [9] [10] [11] performed at device enclosure complying the
category level [10] shown in the following table, some precautions should be implemented as described in the
following sections.
Category
Immunity Level
Contact Discharge to coupling planes (indirect contact discharge)
+2 kV / -2 kV
+4 kV / -4 kV
Contact Discharges to conducted surfaces (direct contact discharge)
Not Applicable
2
*
Air Discharge at insulating surfaces
+2 kV / -2 kV
+4 kV / -4 kV
+8 kV / -8 kV
Table 32: Enclosure ESD immunity level, standards “EN 61000-4-2, EN 301 489-1 V1.8.1, EN 301 489-7 V1.3.1”
2.5.1 General Precautions
The following module interfaces could be involved in the ESD immunity test criticalness depending on the
application board handling. Some precautions are herein suggested.
A series Schottky diode is integrated in LEON-G100/G200 modules as protection on the RESET_N pin. The
external circuit must be able to cause a current flow through the series diode to determine the RESET_N state.
Sensitive interface is the reset line (RESET_N pin):
A 47 pF bypass capacitor (e.g. Murata GRM1555C1H470JA01) have to be mounted on the line termination
connected to the RESET_N pin to avoid a module reset caused by an electrostatic discharge applied to the
application board
2
LEON mounted on application reference design:
Applicability -> EUT with insulating surfaces, air discharges on interconnecting cables between EUT and antenna and auxiliary equipments
Not Applicability -> EUT with conductive surface, direct contact discharge