Integration Guide

LEON-G100/G200 - System Integration Manual
GSM.G1-HW-09002-F3 Preliminary Contents
Page 5 of 101
2.1.3 Antenna checklist ........................................................................................................................ 72
2.2 Design Guidelines for Layout .............................................................................................................. 72
2.2.1 Layout guidelines per pin function ............................................................................................... 72
2.2.2 Footprint and paste mask ............................................................................................................ 78
2.2.3 Placement ................................................................................................................................... 80
2.3 Module thermal resistance .................................................................................................................. 80
2.4 Antenna guidelines ............................................................................................................................. 81
2.4.1 Antenna termination ................................................................................................................... 82
2.4.2 Antenna radiation ....................................................................................................................... 83
2.4.3 Antenna detection functionality .................................................................................................. 85
2.5 ESD Immunity Test Precautions ........................................................................................................... 87
2.5.1 General Precautions .................................................................................................................... 87
2.5.2 Antenna Interface Precautions ..................................................................................................... 88
2.5.3 Module Interfaces Precautions ..................................................................................................... 89
3 Handling and soldering ............................................................................................. 90
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 90
3.2 Soldering ............................................................................................................................................ 90
3.2.1 Soldering paste............................................................................................................................ 90
3.2.2 Reflow soldering ......................................................................................................................... 90
3.2.3 Optical inspection ........................................................................................................................ 92
3.2.4 Cleaning ...................................................................................................................................... 92
3.2.5 Repeated reflow soldering ........................................................................................................... 92
3.2.6 Wave soldering............................................................................................................................ 92
3.2.7 Hand soldering ............................................................................................................................ 92
3.2.8 Rework ........................................................................................................................................ 92
3.2.9 Conformal coating ...................................................................................................................... 92
3.2.10 Casting ........................................................................................................................................ 93
3.2.11 Grounding metal covers .............................................................................................................. 93
3.2.12 Use of ultrasonic processes .......................................................................................................... 93
4 Product Testing........................................................................................................... 94
4.1 u-blox in-series production test ........................................................................................................... 94
Appendix .......................................................................................................................... 95
A Extra Features ............................................................................................................. 95
A.1 Firmware (upgrade) Over The Air (FOTA) (LEON-G200 only) ................................................................ 95
A.2 Firmware (upgrade) Over AT (FOAT) ................................................................................................... 95
A.2.1 Overview ..................................................................................................................................... 95
A.2.2 FOAT procedure .......................................................................................................................... 95
A.3 Firewall ............................................................................................................................................... 95
A.4 TCP/IP ................................................................................................................................................. 95
A.4.1 Multiple IP addresses and sockets ................................................................................................ 96
A.5 FTP ..................................................................................................................................................... 96