Integration Guide

LEON-G100/G200 - System Integration Manual
GSM.G1-HW-09002-F3 Preliminary Contents
Page 4 of 101
Contents
Preface ................................................................................................................................ 3
Contents .............................................................................................................................. 4
1 System description ....................................................................................................... 7
1.1 Overview .............................................................................................................................................. 7
1.2 Architecture .......................................................................................................................................... 8
1.2.1 Functional blocks ........................................................................................................................... 9
1.2.2 Hardware differences between LEON-G100 and LEON-G200 ........................................................ 9
1.3 Pin-out ............................................................................................................................................... 10
1.4 Operating modes ................................................................................................................................ 12
1.5 Power management ........................................................................................................................... 14
1.5.1 Power supply circuit overview ...................................................................................................... 14
1.5.2 Module supply (VCC) .................................................................................................................. 15
1.5.3 Current consumption profiles ...................................................................................................... 22
1.5.4 Battery charger (LEON-G200 only) ............................................................................................... 25
1.5.5 RTC Supply (V_BCKP) .................................................................................................................. 30
1.6 System functions ................................................................................................................................ 31
1.6.1 Module power on ....................................................................................................................... 31
1.6.2 Module power off ....................................................................................................................... 35
1.6.3 Module reset ............................................................................................................................... 36
1.7 RF connection ..................................................................................................................................... 39
1.8 SIM interface ...................................................................................................................................... 40
1.8.1 SIM functionality ......................................................................................................................... 41
1.9 Serial Communication......................................................................................................................... 41
1.9.1 Asynchronous serial interface (UART)........................................................................................... 41
1.9.2 DDC (I
2
C) interface ...................................................................................................................... 52
1.10 Audio .............................................................................................................................................. 55
1.10.1 Analog Audio interface ............................................................................................................... 55
1.10.2 Digital Audio interface ................................................................................................................. 61
1.10.3 Voice-band processing system ..................................................................................................... 63
1.11 ADC input (LEON-G100 only) .......................................................................................................... 64
1.11.1 ADC Calibration .......................................................................................................................... 65
1.12 General Purpose Input/Output (GPIO) ............................................................................................. 66
1.13 M2M Setup Schematic Example ...................................................................................................... 68
1.14 Approvals ........................................................................................................................................ 69
1.14.1 Compliance with FCC and IC Rules and Regulations .................................................................... 69
2 Design-In ..................................................................................................................... 71
2.1 Design-in checklist .............................................................................................................................. 71
2.1.1 Schematic checklist ..................................................................................................................... 71
2.1.2 Layout checklist ........................................................................................................................... 71