Integration Guide
Table Of Contents
- Preface
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Power management
- 1.6 System functions
- 1.7 RF connection
- 1.8 SIM interface
- 1.9 Serial Communication
- 1.10 Audio
- 1.11 ADC input (LEON-G100 only)
- 1.12 General Purpose Input/Output (GPIO)
- 1.13 M2M Setup Schematic Example
- 1.14 Approvals
- 2 Design-In
- 3 Handling and soldering
- 4 Product Testing
- Appendix
- A Extra Features
- B Glossary
- Related documents
- Revision history
- Contact

LEON-G100/G200 - System Integration Manual
GSM.G1-HW-09002-F3 Preliminary Revision history
Page 100 of 101
Revision history
Revision
Date
Name
Status / Comments
-
30/04/2009
tgri
Initial release. Objective specification
A
22/06/2009
lpah
New CI
A1
16/07/2009
tgr
Change of document status to advance information
B
20/08/2009
lpah
Figure 1.1 and Figure 1.2: corrected the LEON block diagram
Figure 1.17: corrected the SIM Application circuit
Document updated for serial port handling
Table 1: renamed pins and description
Chapter 1.9.1: added the figures related to DSR behavior at power-on, RI behavior at SMS Arrival, RI behavior at incoming call and CTS
handling in power saving mode
C
4/11/2009
tgri/lpah/sses
este/fves
Change of document status to Preliminary. Revision of 2.2.2 footprint and paste mask, 2.2.3 paste mask removed
Section 1.5.2completely revised. Added Table 3, updated section 1.5.3.1
Section 1.5.4: added charging temperature range values with clarification
Section 1.5.5: added clarification regarding V_BCKP current consumption; added formula to evaluate external capacitor capacitance
requirement as function of the buffering time; updated application circuits.
Updated Figure 17
Section 1.6.1: added Figure 19: Power on sequence description
Section 1.6.2: added clarification regarding the application circuit to avoid an increase of the module current consumption in power down
mode and added the power off sequence diagram
Added Figure 20: Power off sequence description
Section 1.6.3: added RESET_N equivalent circuit description
Updated Figure 21: Application circuits to reset the module using a push button or using an application processor
Section 1.10.1.3: clarified and updated application circuit description to connect a handset; added application circuit description to
connect an external audio device with analog input/outputs; clarified and updated application circuit description to connect a headset.
Added Figure 20. Section 1.10.1.5: clarified and updated application circuit description in hands free mode
Section1.10.2: added clarification regarding the application circuit to avoid an increase of the module current consumption in power
down mode. Section 1.8: clarified and updated application circuit description for the SIM card. Section 1.9.1: corrected MAX3237
description; added clarification regarding the application circuit to avoid an increase of the module current consumption in power down
mode. Section 1.10: clarified as the measured value is input impedance dependent
Section 1.12: added clarification regarding the application circuit to avoid an increase of the module current consumption in power down
mode.
Updated section 2.1: Check UART signals direction, since the signal names follow the ITU-T V.24 Recommendation.
Added section 2.3 to explain module thermal resistance. Section 1.9.1: corrected supported UART frame format. Corrected and improved
description Updated and improved Figure 3: Power supply concept
Added VCC extended and normal operating ranges description and clarified DC power supply requirements in section 1.5.2
Updated and improved Figure 7 content and caption
Clarified current profile description in section 1.5.3.2
Updated and improved content and caption
Clarified charger requirements in section 1.5.4
Grouped sections Module power on, Module power off, Module reset into the 1.6 System functions chapter
Updated and improved Figure 19: Power on sequence description
Updated and improved Figure 20: Power off sequence description
Updated Figure 37: Headset mode application circuit content
Clarified I2S PCM mode path in section 1.10.2.1
Updated section 1.9.1: clarified, added and corrected UART features, UART signal behavior,.
Updated and improved UART signal behavior (AT commands interface case) content and caption
Updated Figure 25: UART default frame format (8N1) description caption
Deleted the double repeated point in the Design-in checklist
Clarified pins arrangement in section 2.2.1
Clarified ground plane requirements in section 2.2.1.4
Renumbered sections Antenna termination, Antenna radiation, Antenna detection functionality
Corrected AT Commands Manual code in Related documents section
Removed “System Configuration“ chapter
D
01/29/2010
lpah
Improved audio interfaces and updated approvals chapter
E
22/04/2010
lpah
Aligned the document to LEON-G100-04S-00 and LEON-G200-04S-00
Digital Audio Interface supported by LEON-G100
F
08/07/2010
lpah
Aligned the document to LEON-G100-05S-00 and LEON-G200-05S-00
F1
30/07/2010
lpah
Added more details on Additional hints for the VCC supply application circuits