Specifications

Chipset
Table 3. Chipset specifications
Description Values
Type Integrated with the processor (Intel Gemini Lake)
Non-volatile memory on chipset Yes
BIOS configuration Serial Peripheral Interface (SPI) 16 MB onboard SPI flash
Trusted Platform Module (TPM) 2.0 Security Device (Discrete
TPM Enabled)
24 KB on TPM 2.0 on chipset
Firmware—TPM (Discrete TPM disabled)
By default, the Platform Trust Technology (PTT) feature is visible
to the operating system.
Operating system
• Wyse ThinOS
• Wyse ThinOS PCoIP
• Windows 10 IoT Enterprise
Memory
Table 4. Memory specifications
Description Values
Minimum memory configuration 4 GB (1 x 4 GB module)
Maximum memory configuration 8 GB
Number of slots 2 SODIMM
Maximum memory supported per slot 8 GB
Memory option
4 GB - 1 x 4 GB
8 GB - 1 x 8 GB
8 GB - 2 x 4 GB
Type
DDR4
Speed
2400 MHz
External ports and connectors
Table 5. Ports and connectors
Description Values
Network One RJ45, 10/100/1000
USB
• One USB 3.1 Gen 1 (side panel)
• Two USB 3.1 Gen 1 (back panel)
• One USB 3.1 Gen 1 with PowerShare (back panel)
• One USB 2.0 (back panel)
• One USB 2.0 with Smart Power On (back panel)
Audio
• Line-out jack
• Global Headset Audio jack
Specifications of Wyse 5470 All-in-One Thin Client 13